Laminate Tape Cutting With Feedback for Embedded Component Positioning
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Solution Overview
Problem
The challenge of accurately positioning electronic components within narrow strips of laminate tape during the cutting process is exacerbated by the laminate layers' inherent tension, leading to positional deviations and potential quality issues.
Innovation Solution
Implement a measuring device downstream of the cutting device to detect positional deviations, and adjust the synchronous movement of the transport and gripper devices to correct these deviations, using control mechanisms based on detected offset values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the laminate layers are moved synchronously by a predetermined distance during cutting, then the cutting position is controlled, but positional deviations occur due to inherent tension in the laminate layers
Solution Approach 1:
A measuring device detects the actual position of the component in the laminate component downstream of the cutting device. When a deviation of the actual position from a target position is detected, the synchronous movement of the transport means and gripper device is controlled in dependence on the detected deviation, creating a closed-loop feedback system that compensates for positioning errors caused by laminate tension
Solution Approach 2:
The synchronous movement distance of the transport means and gripper device is dynamically adjusted based on detected positional deviations. By changing the movement parameter in response to measured position errors, the system compensates for laminate shrinkage and maintains accurate component positioning despite inherent material tension
2Productivity
If narrow strips are cut from the laminate tape, then individual laminate components are produced, but cutting accuracy deteriorates due to laminate shrinkage and tension
Solution Approach 1:
The measuring device detects actual component positions after cutting, and the control system adjusts the synchronous movement for subsequent cutting operations based on detected deviations. This feedback mechanism continuously corrects cutting accuracy despite laminate shrinkage, maintaining precision while enabling continuous high-speed production
Solution Approach 2:
The system performs measurement and correction actions in advance for subsequent cutting operations. By detecting position deviations and adjusting movement parameters before the next cut, the system proactively prevents accuracy deterioration rather than reacting to defects after they occur
Data Source
AI summary
A method for producing separated strip-like laminate components including an electronic component embedded between two laminate layers of a tape-like material. Individual components are placed at defined intervals by a placement device onto a tape-like, lower first laminate layer moved in a conveying direction by a transport device, after which a tape-like, upper second laminate layer moved in the conveying direction is applied to the first laminate layer with embedding of the components to form a laminate tape. The individual strip-like laminate components are cut from the laminate tape by a cutting device having a movable cutting blade, which laminate components are picked up by a gripper device and transported away. The front end of the laminate tape is gripped by the gripper device in the region of a component and moved synchronously with the clocked movement of the transport device by a predetermined distance through the cutting device and positioned relative to the cutting blade. The actual position of the component in the laminate component in relation to the conveying direction is detected by a measuring device connected downstream of the cutting device. When a deviation of the actual position from a defined target position is detected, the synchronous movement of the transport device and the gripper device is controlled in dependence on the detected deviation.