Laminate Transformer Lead Frame Overlap for Heat Dissipation
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Solution Overview
Problem
Existing laminate transformer designs face challenges in efficiently dissipating heat due to high thermal impedance caused by low thermal conductivity of materials, which can lead to overheating and reduced performance.
Innovation Solution
A lead frame is designed to partially overlap a portion of the coil in the laminate transformer, establishing a direct thermal conductive path that bypasses the low thermal conductivity of the substrate, allowing heat to be dissipated directly into the lead frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the lead frame is spaced apart from the magnetic core element and coil, then electrical isolation is maintained, but thermal conductivity deteriorates due to high thermal impedance of the substrate
Solution Approach 1:
The substrate serves as a thermal intermediary by allowing the lead frame to overlap the coil directly, creating a thermal conduction path through the substrate material itself rather than requiring direct contact between the lead frame and magnetic core element. This resolves the contradiction by enabling heat flow while maintaining electrical isolation spacing.
2Temperature
If the lead frame overlaps the coil to improve thermal conductivity, then heat dissipation is improved, but electrical isolation may be compromised
Solution Approach 1:
The lead frame is designed with selective overlapping - it overlaps the coil in specific regions where thermal conduction is needed, while maintaining spacing from the magnetic core element in regions where electrical isolation is critical. This local differentiation of contact and non-contact zones resolves the contradiction between thermal management and electrical isolation requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves thermal conductivity by up to 12% with minimal impact on transformer quality factor and efficiency, reducing manufacturing costs without additional steps.
Implementation Method 1
A portion of the lead frame overlaps a portion of the first coil to provide a thermal conductive path
Data Source
AI summary
An apparatus has a laminate substrate that has a first surface and an opposite second surface. A laminate transformer is located within the laminate substrate between the first surface and the second surface. The transformer has a first coil adjacent the first surface and a second coil adjacent the second surface. A magnetic core element on the first surface overlaps a portion of the first coil. A lead frame on the first surface is spaced apart from the magnetic core element. A portion of the lead frame overlaps a portion of the first coil to provide a thermal conductive path.


