Laminated Adhesive Sheet for Semiconductor Thermal Management
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Solution Overview
Problem
Existing adhesive compositions for electronic components, such as semiconductor chips and heat dissipators, lack sufficient thermal conductivity, leading to potential malfunctions due to temperature rises and heat accumulation issues.
Innovation Solution
A laminated adhesive composition sheet with alternating layers of organic compounds and anisotropically shaped thermal conductive inorganic particles, where the layer with a higher organic compound content scatters to facilitate orientation of inorganic particles along the film thickness direction, enhancing thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If inorganic particles are added to increase thermal conductivity, then thermal conductivity is improved, but the adhesive composition becomes heterogeneous and difficult to process
Solution Approach 1:
The adhesive composition is divided into multiple layers with different functions: a first layer containing inorganic particles for thermal conductivity, and a second layer without inorganic particles for homogeneity and processability. This segmentation allows each layer to optimize its specific function without compromising the other.
Solution Approach 2:
Different regions of the adhesive composition have different properties: the first layer near the semiconductor chip has high inorganic particle content for thermal management, while the second layer has no inorganic particles for ease of processing and uniform adhesion. This local differentiation resolves the contradiction between thermal performance and processability.
2Reliability
If inorganic particles are highly filled to increase thermal conductivity, then thermal conductivity is improved, but the adhesive composition becomes heterogeneous and difficult to process
Solution Approach 1:
The adhesive is segmented into two layers: the first layer contains highly filled inorganic particles (50-90 wt%) for maximum thermal conductivity, while the second layer is particle-free for easy manufacturing and application. This eliminates the contradiction by isolating the high-fill layer from processing requirements.
Solution Approach 2:
The second layer acts as an intermediary between the high-fill first layer and the substrates, providing a homogeneous, easily processable adhesive layer that facilitates manufacturing while the first layer handles thermal management.
3Device complexity
If a single-layer adhesive composition is used, then the structure is simple, but the thermal conductivity is insufficient
Solution Approach 1:
The adhesive is divided into two functional layers: a first layer optimized for thermal conductivity with high inorganic particle content, and a second layer optimized for adhesion and processability without particles. This segmentation achieves high thermal performance while maintaining relatively simple structure and manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides excellent film thickness-wise thermal conductivity, preventing semiconductor chip malfunctions by efficiently dissipating heat and improving the reliability and adhesiveness of semiconductor devices.
Implementation Method 1
the layer A and/or the layer B containing anisotropically shaped thermal conductive inorganic particles
Implementation Method 2
the layer with a higher organic compound content scatters to facilitate orientation of inorganic particles along the film thickness direction
Data Source
AI summary
Provided is an adhesive composition sheet containing an organic compound and inorganic particles, the adhesive composition sheet including a structure obtained by stacking a layer A that contains at least an organic compound and a layer B that contains an organic compound and inorganic particles, the layer A having a content rate of the organic compound larger than the content rate of the organic compound in the layer B, and the layer A and/or the layer B containing anisotropically shaped inorganic particles. The present invention provides an adhesive composition sheet excellent in thermal conductivity and insulating properties after cured.