Laminated Antenna Structures for Millimeter-Wave Package Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current radio/wireless communication systems for millimeter-wave applications face challenges in packaging RF chips with integrated antennas or phased arrays due to high costs and complexity, especially in achieving high antenna gains and beam alignment in indoor environments with limited line-of-sight signal transmission.
Innovation Solution
The integration of semiconductor IC chips with laminated antenna structures and waveguide structures within a compact antenna package, featuring multiple package levels with metallic vias and probes for efficient energy coupling, allowing for the formation of compact, low-cost integrated radio/wireless communications systems with steerable arrays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete components are assembled using expensive waveguides and package-level microstrip structures, then antenna gain can be achieved, but manufacturing cost and device complexity increase significantly
Solution Approach 1:
The patent combines the antenna structure with the package substrate itself, creating an integrated antenna-package structure. The antenna elements are formed directly on or within the package layers, eliminating the need for separate waveguide components and reducing packaging complexity while maintaining antenna performance.
Solution Approach 2:
The package substrate serves multiple functions: it provides mechanical support for the IC chip, acts as the antenna radiation structure, and serves as the mounting platform for other components. This multi-functionality reduces the number of separate components needed and simplifies the overall device architecture.
2Reliability
If high gain antennas are designed for wireless video applications, then antenna gain increases to 30 dBi, but beam width becomes very narrow making pointing difficult
Solution Approach 1:
The antenna system is divided into multiple independent antenna elements that can be individually controlled. By segmenting the antenna into multiple elements, the system can electronically steer beams across different directions without requiring mechanical pointing, thus maintaining high gain while improving ease of operation.
Solution Approach 2:
The antenna system employs dynamic beam steering capability where the radiation pattern can be electronically adjusted in real-time. This allows the high-gain antenna to adapt its beam direction dynamically to track moving targets or adjust to changing environmental conditions, making pointing unnecessary.
3Reliability
If phased arrays are used for beam alignment and finding signal transmission paths, then reliability improves, but manufacturing cost and complexity increase due to expensive components and extensive labor
Solution Approach 1:
The phased array elements are integrated directly into the package substrate structure, combining the antenna array with the packaging infrastructure. This integration eliminates the need for separate array components and reduces assembly labor, making phased array technology more manufacturable while maintaining signal transmission reliability.
Solution Approach 2:
The patent uses planar printed circuit board techniques to create antenna elements that replicate the functionality of traditional three-dimensional phased array structures. By copying the essential radiation patterns and impedance characteristics using two-dimensional PCB traces, the system achieves phased array performance at lower manufacturing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of compact, cost-effective integrated radio/wireless communications systems with high antenna gains and improved beam alignment capabilities, suitable for millimeter-wave applications, while reducing manufacturing complexity and costs.
Implementation Method 1
a vertical probe connected to an end of the antenna feed line to couple energy from the antenna feed line to the laminated waveguide
Implementation Method 2
antenna structures with laminated waveguide structures that are integrally constructed as part of an antenna package to form compact integrated radio/wireless communications systems for millimeter wave applications
Data Source
AI summary
Apparatus and methods for packaging IC chips and laminated antenna structures with laminated waveguide structures that are integrally constructed as part of an antenna package to form compact integrated radio/wireless communications systems for millimeter wave applications.