Laminated Assembly Sealing Patch for Moisture Ingress Prevention

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Solution Overview

Problem

Laminated assemblies, such as those in vehicles, face moisture penetration issues due to inadequate sealing around conductive connectors, leading to air and water ingress, which is problematic for functional elements like heating systems and antennas.

Innovation Solution

A thin thermoplastic patch is used between the conductive means and the substrate to prevent air, moisture, and water from entering the laminated assembly, ensuring a secure and watertight seal by extending over the edges of the connectors and being larger than the conductive means, with a thickness between 100 μm and 250 μm, and made from materials like PVB or polyurethane.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If sealing tape is used to seal the flat connector, then the connector is protected, but moisture and air penetration occurs due to poor bonding and small sealing surface

Engineering Contradiction:
Improvesealing effectivenessVSAvoidmoisture penetration
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent removes the sealing tape from the system entirely. Instead of using a separate sealing component that fails due to poor bonding and small sealing surface, the thermoplastic interlayer itself is used to provide both structural support and sealing function, eliminating the interface between sealing tape and connector that causes moisture penetration

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the sealing function with the thermoplastic interlayer that already provides structural support. By integrating the sealing function into the existing interlayer material rather than using a separate sealing tape, the solution achieves both mechanical support and effective sealing against moisture and air

Inventive Principle:
Principle #5Merging (Combining)

2Device complexity

If notches are made through the thermoplastic interlayer to pass the flat connector, then sealing tape can be removed, but the bonding area is limited to around 3 mm and tightness is not ensured

Engineering Contradiction:
Improvesealing structureVSAvoidtightness
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

Instead of making notches through the thermoplastic interlayer to pass the connector and then relying on limited bonding areas, the patent inverts the approach by having the connector pass through the interlayer without notches and achieving sealing through the interlayer material itself covering the connector, thus ensuring tightness without geometric limitations

Inventive Principle:
Principle #13The other way round (Inversion)

3Ease of manufacture

If the collector is attached to the inner face of the glazing prior to positioning the thermoplastic interlayer, then connection is established, but bending and passing the flat connector by notches becomes problematic

Engineering Contradiction:
Improveconnector installationVSAvoidconnector positioning
Core Design Contradiction:
Ease of manufactureVSEase of operation

Solution Approach 1:

The patent removes the notching operation from the manufacturing process. By eliminating the need to cut notches through the thermoplastic interlayer, the process avoids the complexity of coordinating collector attachment timing with interlayer positioning, making the manufacturing sequence simpler and less error-prone

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS11001038B2Laminated assembly
Publication Date: 2021.05.11 AGC GLASS EUROPE SA
  • US11001038B2 patent drawing
  • US11001038B2 patent drawing
  • US11001038B2 patent drawing

AI summary

An improved laminated assembly comprising functional elements with connections extending outside of the laminated assembly preventing air, moisture and water from entering the assembly as well as a method to prevent air, moisture and water from entering a laminated assembly.