Laminated Assembly Temporary Bonding Without Adhesive Residue
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Solution Overview
Problem
The existing methods for manufacturing laminated semiconductor device packages, such as chip-on-wafer packaging, face challenges with time-consuming joining processes due to positional shifts and height differences of chips caused by thick organic adhesives, which also leave residues that contaminate the chips and complicate the separation process.
Innovation Solution
A method involving the deposition of an oxide film on the surfaces of chips and a temporary support substrate, followed by hydrophilization and temporary joining using hydrogen bonding without organic adhesives, and subsequent vaporization of water to facilitate easy separation of the temporary support substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a thick layer of organic adhesive is used to temporarily join chips to the temporary support substrate, then the chips can be joined without precise positioning, but the chips shift from their desired positions due to adhesive shrinkage during curing
Solution Approach 1:
The patent extracts and removes the organic adhesive from the temporary joining process entirely. Instead, it uses a thick oxide film (1-10 μm) deposited on the temporary support substrate surface to enable temporary joining through van der Waals forces, eliminating the positioning errors caused by adhesive shrinkage during curing
Solution Approach 2:
The patent replaces the chemical bonding mechanism of organic adhesive with physical adsorption through van der Waals forces generated by the oxide film. This substitution eliminates the shrinkage problem inherent in chemical curing processes while maintaining effective temporary joining
2Ease of manufacture
If a thick layer of organic adhesive is used to temporarily join chips, then positioning is easier, but the chips become different in heights requiring strong pressing that causes further movement
Solution Approach 1:
The patent removes the organic adhesive that causes height variations and subsequent pressing issues. The oxide film provides sufficient adhesion without requiring thick layers, maintaining uniform chip heights and eliminating the need for strong pressing that causes positional shifts
3Strength
If organic adhesive is used for temporary joining, then strong bonding is achieved, but the adhesive is difficult to separate and leaves residues that contaminate chips
Solution Approach 1:
The patent extracts and eliminates the organic adhesive from the process, replacing it with an oxide film that provides sufficient temporary bonding through van der Waals forces without leaving harmful residues. The oxide film can be cleanly removed without contaminating the chip surfaces
Solution Approach 2:
The patent changes the bonding mechanism from chemical adhesive bonding to physical adsorption through van der Waals forces. This parameter change allows for easy separation without residue while maintaining adequate bonding strength for the temporary joining process
4Object-affected harmful factors
If cleaning process is performed to remove adhesive residues, then chip contamination is reduced, but the manufacturing process becomes time-consuming
Solution Approach 1:
The patent removes the source of contamination (organic adhesive) from the process entirely. Without adhesive residues to remove, the time-consuming cleaning process becomes unnecessary, directly reducing manufacturing cycle time while maintaining chip purity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for efficient and precise temporary joining and easy separation of the support substrate from the chips, reducing contamination and process time, while avoiding the use of organic adhesives that can weaken semiconductor devices.
Implementation Method 1
a hydrophilizing step of performing a hydrophilizing process on an exposed surface of the oxide film
Implementation Method 2
temporary joining step of temporarily joining the plate-shaped object and the temporary support substrate with the oxide film interposed therebetween
Implementation Method 3
a vaporizing step of vaporizing water contained in the oxide film in an atmosphere whose temperature is kept in a second temperature range higher than the first temperature range
Data Source
AI summary
A method of manufacturing a laminated assembly includes depositing an oxide film on each of one surface of a plate-shaped object and a temporary joint surface of a temporary support substrate in an atmosphere whose temperature is kept in a first temperature range, performing a hydrophilizing process on an exposed surface of the oxide film, temporarily joining the plate-shaped object and the temporary support substrate with the oxide film interposed therebetween, forming a joint member on a joint surface of a support substrate, joining the plate-shaped object and the support substrate to each other with the joint member interposed therebetween, vaporizing water contained in the oxide film in an atmosphere whose temperature is kept in a second temperature range higher than the first temperature range, and separating the plate-shaped object and the temporary support substrate from each other.