Laminated Circuit Board Stacking With Through-Vias for Higher Yield
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Solution Overview
Problem
Integrating multiple electronic devices on a flexible board results in increased area requirements and decreased yield ratios due to the limitations of semiconductor technology and material instability.
Innovation Solution
Individual circuit boards with pre-defined circuit layouts are overlapped and electrically connected using through-holes filled with conductive material to form through-vias, allowing for the integration of multiple devices without increasing area or reducing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple electronic devices are integrated on a single flexible board, then device functionality is increased, but the area required increases and yield ratio decreases
Solution Approach 1:
The patent transitions from planar integration to three-dimensional stacking by forming through-holes penetrating the flexible board and filling them with conductive material to create vertical interconnections between multiple boards. This allows electronic devices to be integrated in the thickness dimension rather than only in the planar area, thereby increasing device functionality without proportionally increasing the board area.
2Adaptability or versatility
If multiple electronic devices are integrated on a single flexible board, then device functionality is increased, but the yield ratio decreases
Solution Approach 1:
The patent divides the integrated electronic device into multiple separate flexible boards, each potentially manufactured and tested independently. The through-holes and conductive fillings provide interconnection between these segmented boards, allowing for modular assembly. This segmentation enables better quality control and higher yield ratios compared to manufacturing a single large integrated board, while still achieving the desired device functionality through the stacked configuration.
3Reliability
If through-holes are formed and filled with conductive material to connect multiple boards, then electrical connectivity between boards is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent forms through-holes and fills them with conductive material during the manufacturing process before the boards are fully assembled and functional. This preliminary action ensures that electrical connectivity pathways are established in advance, reducing the risk of connection failures and simplifying subsequent assembly operations. The conductive filling is performed while the board structure is still accessible, making the process more efficient than attempting to create connections after assembly.
Data Source
AI summary
Electronic devices to be integrated are formed on individual boards, the boards are laid to overlap each other in a predetermined relationship, and then through vias are formed at predetermined positions. With this, the electronic devices are electrically connected to each other, and function as an integrated device.