Laminated Bus Structure Reducing Stray Inductance in Cascaded Devices

The patent transitions from a conventional planar bus bar structure to a three-dimensional laminated bus structure with multiple conductive layers stacked in parallel. This dimensional change allows current to flow through multiple paths simultaneously, reducing the loop area and thereby minimizing stray inductance and capacitance effects that cause voltage overshoot in series-cascaded electrical devices.

The patent combines multiple conductive layers into a single integrated laminated bus structure. By merging separate conductive paths into a unified multi-layer structure with optimized current distribution, the system achieves reduced stray impedance while maintaining the power handling capability of cascaded devices.

The laminated bus structure utilizes multiple conductive layers arranged in three-dimensional space to create parallel current paths. This dimensional approach reduces the effective loop area during switching operations, minimizing magnetic field generation and associated stray inductance while preserving switching control functionality.

The patent converts the potentially harmful effect of switching operations by designing the laminated structure to inherently reduce magnetic field generation. The optimized current distribution through multiple layers transforms the switching action from a source of stray inductance into a controlled operation with minimized electromagnetic interference.