Laminated Ceramic Component Dummy Electrode Plating
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Solution Overview
Problem
Existing laminated ceramic electronic components face issues with moisture ingress and reduced fixing strength due to the limitations of plating film formation on the WT surface, which affects the reliability and capacitance of the components.
Innovation Solution
Incorporating internal and external dummy electrodes with specific orientations and connecting them to ensure comprehensive plating film coverage, thereby enhancing the fixing strength and preventing moisture ingress, while allowing for controlled plating film growth and improved dimensional accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If plating is applied directly onto the end surfaces of the component main body, then the effective volume for capacitance can be improved, but the fixing strength of the plating film decreases and moisture ingress occurs
Solution Approach 1:
The patent applies a conductive paste layer to the end surfaces of the component main body before applying the plating film. This preliminary conductive paste layer serves as an anchor for the plating film, ensuring strong adhesion and preventing moisture ingress, while still allowing the plating film to extend over the exposed ends of internal electrodes for effective capacitance utilization
Solution Approach 2:
The patent creates a composite structure consisting of a conductive paste layer combined with a plating film. The conductive paste layer provides strong adhesion to the ceramic substrate, while the plating film provides electrical conductivity and capacitance functionality. This composite approach resolves the contradiction between adhesion strength and electrical performance
2Volume of moving object
If the paste electrode layer thickness is reduced to increase effective volume, then the capacitance volume fraction improves, but the electrical connection between internal electrodes deteriorates
Solution Approach 1:
The patent uses a composite structure of conductive paste layer and plating film to replace the traditional thick paste electrode layer. The plating film provides the electrical connection function with minimal thickness, while the conductive paste layer ensures proper adhesion and distribution, thereby maximizing the effective volume for capacitance without compromising electrical connection quality
3Reliability
If plating film coverage is extended to ensure moisture prevention, then the reliability improves, but the manufacturing precision and dimensional control deteriorate
Solution Approach 1:
The conductive paste layer is applied first as a preliminary layer that defines the coverage area and provides a uniform base. This preliminary layer acts as a mask and anchor, allowing the plating film to be deposited with precise dimensional control while ensuring complete coverage for moisture prevention. The paste layer's viscosity and drying characteristics enable precise area control before plating
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents moisture ingress and enhances the reliability of laminated ceramic electronic components by ensuring comprehensive plating film coverage and improved fixing strength, thus addressing the limitations of existing technologies.
Implementation Method 1
a plating film provided on at least the WT surface so as to electrically connect the respective exposed ends of the plurality of internal electrodes to each other
Data Source
AI summary
In a method for manufacturing a laminated ceramic electronic component, when a plating film to define an external terminal electrode is formed by plating exposed ends of a plurality of internal electrodes at a WT surface of a component main body, ingress of a plating solution may be caused from a gap between an end edge of the plating film and the component main body to decrease the reliability of a laminated electronic component obtained. An internal dummy electrode is provided around a region where the exposed ends of the plurality of internal electrodes are distributed in the WT surface of the component main body. The internal dummy electrode includes two LW-direction sections extending parallel or substantially parallel to each other in a direction along the LW surface, and two LT-direction sections extending parallel or substantially parallel to each other in a direction along the LT surface. The plating film is formed at least over the exposed end of the internal dummy electrode. The internal dummy electrode is formed by wrapping an outer layer sheet with the internal dummy electrode formed around a laminate composed of ceramic layers and the internal electrodes.