Laminated Ceramic Pressure Sensor for High-Temperature Accuracy
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Solution Overview
Problem
Existing high-temperature pressure sensors, such as ceramic pressure sensors, face challenges in maintaining accurate pressure measurement and signal integrity due to temperature-induced shifts and signal distortion in harsh environments.
Innovation Solution
A pressure-sensitive chip is developed using a laminated ceramic body with multiple capacitive plates and cavities, filled with conductive paste and supported by carbon films, which converts capacitance signals into differential voltage signals for improved accuracy and resistance to high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single-capacitor pressure sensor is used in a high-temperature environment, then the sensor can directly measure pressure using ceramic material with good temperature resistance, but the measurement accuracy deteriorates due to large temperature-induced shifts and signal distortion
Solution Approach 1:
The pressure sensor is divided into multiple independent capacitors (first capacitor, second capacitor, third capacitor) with separate capacitive plates and cavities. Each capacitor is formed by stacking and sintering green ceramic sheets with through holes, creating modular units that can be independently configured to achieve desired measurement accuracy while maintaining temperature resistance.
Solution Approach 2:
Multiple capacitors are combined within a single pressure sensor device, with their output signals processed together to compensate for temperature-induced shifts. The merged configuration allows the sensor to maintain the temperature resistance of ceramic materials while achieving improved measurement accuracy through signal integration and differential measurement techniques.
2Device complexity
If a single-capacitor pressure sensor is used in a high-temperature environment, then the structure remains simple, but signal distortion occurs during transmission due to high temperature effects
Solution Approach 1:
The signal transmission is segmented into multiple parallel paths through multiple capacitors, each producing output signals that are less susceptible to individual distortion. This segmentation of the signaling function reduces overall signal distortion while maintaining a relatively simple overall device structure based on modular ceramic capacitor units.
Solution Approach 2:
The sensor configuration enables feedback mechanisms where output signals from multiple capacitors are processed to compensate for temperature-induced distortions. The feedback processing corrects signal degradation in real-time, maintaining signal integrity without requiring complex additional hardware structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a high-accuracy pressure measurement system capable of operating in high-temperature environments with reduced signal distortion, utilizing a Platinum conductive paste and a processing module to convert and amplify signals effectively.
Implementation Method 1
The first-type through hole of the second green ceramic sheet, the first-type through hole of the third green ceramic sheet, the first-type through hole of the fourth green ceramic sheet, the first-type through hole of the fifth green ceramic sheet, the first-type through hole of the sixth green ceramic sheet, the first-type through hole of the seventh green ceramic sheet, and the first-type through hole of the eighth green ceramic sheet are aligned with each other and filled with a conductive paste
Implementation Method 2
A first capacitive plate is provided on a bottom surface of the first green ceramic sheet. A first cavity matching the first capacitive plate is provided on a top surface of the second green ceramic sheet. A second capacitive plate is provided on a bottom surface of the third green ceramic sheet.
Data Source
AI summary
A pressure-sensitive chip, a pressure sensor, and a pressure monitoring system. In an embodiment, a pressure-sensitive chip and a signal processing module are packaged to form a pressure sensor. The pressure sensor and a display instrument are connected to form a pressure monitoring system. A pressure-sensitive chip is a ceramic body made of eight green ceramic sheets by stacking and sintering, and includes two capacitors. In another embodiment, a pressure signal of a measurement area is obtained by a method including the following steps: sensing a pressure in a measurement area by the pressure-sensitive chip; generating a capacitance signal by the pressure-sensitive chip; converting the capacitance signal to a voltage signal by the signal processing module; and converting the voltage signal into the pressure signal by the display instrument.