Laminated Ceramic Component Strip Electrode Pattern
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing manufacturing methods for laminated ceramic electronic components result in delamination and reliability issues due to steps between inner-electrode arranged areas and other areas, leading to unstable mounting and reduced product reliability.
Innovation Solution
A method involving the printing of strip inner electrode patterns with thicker central portions and thinner sides on ceramic green sheets, which are then laminated and cut to form unfired ceramic element assemblies with thick led-out portions, and applying ceramic paste to cover exposed areas, preventing delamination and maintaining flatness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of laminated ceramic layers is increased to achieve miniaturization and larger capacitance, then the capacitance increases, but the step between inner electrode patterns and gap areas becomes more obvious, causing delamination and mounting failures
Solution Approach 1:
The patent applies local quality by creating a thick portion specifically at the led-out area of the inner electrode pattern where it is most needed to compensate for the step, while keeping other areas at normal thickness. This localized thickening prevents delamination at the critical led-out portion without unnecessarily increasing the overall component size or affecting other areas.
Solution Approach 2:
The patent implements preliminary action by forming the thick portion of the inner electrode pattern before lamination, so that when the ceramic layers are stacked, the step compensation is already in place. This preliminary thickening prevents the accumulation of steps that would otherwise cause delamination in multi-layer configurations.
2Reliability
If the thickness of led-out parts of inner electrodes is increased to cancel the step of gap area, then delamination is prevented, but the manufacturing complexity increases due to asymmetric electrode pattern design
Solution Approach 1:
The patent resolves the complexity issue by applying local quality - the inner electrode pattern has a thick portion only at the led-out area while maintaining standard thickness elsewhere. This localized modification achieves delamination prevention without requiring complete redesign of the entire electrode pattern, thus limiting the increase in manufacturing complexity to only the specific area where it is needed.
3Ease of operation
If asymmetric inner electrode patterns with thick led-out portions are used, then flatness is maintained and mounting stability improves, but the manufacturing precision requirements increase for printing and alignment
Solution Approach 1:
The patent reduces manufacturing precision requirements by applying local quality - the asymmetric thick portion is created only at the led-out area where it is most critical for mounting stability, while the rest of the electrode pattern maintains standard geometry. This localized approach concentrates the precision requirements to a specific area rather than requiring high precision across the entire pattern.
Data Source
AI summary
A method for manufacturing a laminated ceramic electronic component is provided in which a plurality of ceramic green sheets having printed strip inner electrodes patterns, each including a thick portion at a width-direction center and thin portions at respective width-direction sides of the thick portion, are laminated so that the thin portions overlap and the thick portions do not overlap to form an unfired mother laminated body. This unfired mother laminated body is cut along predetermined cut lines that are vertical to each other to obtain a plurality of unfired ceramic element assemblies. By applying ceramic paste to cover exposed portions of inner electrode patterns exposed to lateral surfaces, side gap areas are formed between a first inner electrode pattern and first and second lateral surfaces of the unfired ceramic element assembly and between a second inner electrode pattern and the first and second lateral surfaces.