Laminated Ceramic Top Plate for Semiconductor Workpiece Carrier
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Solution Overview
Problem
In semiconductor processing, the thermal and electrical environment provided by workpiece supports must be precise to ensure consistent production of small circuits and structures, but existing supports often have dimensional variations that affect quality and yield, requiring adjustments for different setups.
Innovation Solution
A laminated top plate for workpiece carriers is fabricated using ceramic sheets with embedded conductive paste, where the paste is dispensed, compacted, and sintered between the sheets to create a consistent and precise thermal and electrical environment, ensuring uniformity across multiple supports.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional monolithic supports are used, then manufacturing is simpler, but dimensional precision and consistency deteriorate
Solution Approach 1:
The support structure is divided into multiple thin ceramic layers (e.g., 0.5-2mm each) that are laminated together to form the top plate. Each layer can be independently manufactured and then bonded, allowing for better dimensional control and consistency while achieving the required precision for semiconductor processing applications.
Solution Approach 2:
The invention uses composite ceramic structures with embedded conductive materials (such as metal traces or particles) within the ceramic matrix. This creates a composite material that maintains the dimensional stability and precision of ceramic while incorporating the necessary electrical conductivity for electrostatic chucking, resolving the contradiction between precision and functional complexity.
2Productivity
If dimensional variations in supports are reduced, then production consistency improves, but manufacturing complexity increases
Solution Approach 1:
By segmenting the top plate into multiple standardizable thin layers, each layer can be manufactured using consistent processes and then assembled. This modular approach improves production consistency across multiple supports while managing manufacturing complexity through standardization of components.
Solution Approach 2:
The invention controls dimensional parameters by precisely controlling the thickness and dimensions of individual ceramic layers during lamination, as well as controlling the embedding depth and distribution of conductive materials. These parameter changes enable consistent dimensional tolerances across production batches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances precision and consistency in thermal and electrical components, leading to higher quality and uniformity in semiconductor production, reducing costs and downtime by maintaining consistent production results across different supports.
Implementation Method 1
An electrostatic chuck (ESC) has one or more embedded conductive electrodes to generate an electric field that holds the wafer on the chuck using static electricity
Implementation Method 2
The pedestal may include an embedded heater to control the temperature of the substrate and, in some cases, to provide elevated temperatures that may be used in the process
Implementation Method 3
compact the ceramic sheets together with the paste, and sinter the paste
Data Source
AI summary
A laminated top plate of a workpiece carrier is described that is particularly suitable for mechanical and semiconductor processing. In one example, A method of fabricating a workpiece carrier top plate includes dispensing conductive paste onto at least one of a plurality of ceramic sheets, embedding the paste between the plurality of ceramic sheets, compacting ceramic sheets together with the paste, and sintering the paste.