Laminated Device Chip Fabrication for Handling Ultra-Thin Wafers
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Solution Overview
Problem
The challenge lies in manufacturing extremely thin semiconductor device chips that are difficult to handle and require stable and efficient bonding processes, as existing methods struggle to thin device chips to dimensions of 10 μm or less while maintaining ease of handling and reliable bonding.
Innovation Solution
A method involving a support substrate to stabilize and thin the first device wafer, followed by cutting along dicing lines, affixing it to a second device wafer, and peeling off the support substrate, allowing for the production of extremely thin laminated device chips through a series of processing steps including grinding, cutting, and adhesive management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If device chips are thinned to 10 μm or less to meet demands for smaller and thinner semiconductor device packages, then the package size and electric power consumption are reduced, but the device chips become extremely difficult to handle and require stable bonding processes
Solution Approach 1:
The patent introduces a support substrate as an intermediary carrier that holds multiple device chips during the thinning and bonding processes. This support substrate enables handling of extremely thin device chips (10 μm or less) by providing mechanical support, allowing the chips to be processed and bonded without direct manual handling that would be difficult with such thin dimensions.
2Volume of moving object
If device chips are thinned to 10 μm or less to reduce package size, then smaller and thinner packages are achieved, but the bonding process stability becomes challenging
Solution Approach 1:
The patent performs preliminary actions by arraying multiple device chips on a support substrate before thinning, and maintaining their arrayed state during the thinning process. This preliminary arrangement ensures that when the chips are finally bonded, they are already in the correct positions and orientations, improving bonding process stability. The support substrate is peeled off after bonding completes, leaving the chips properly connected.
3Ease of operation
If device chips are arrayed on a support substrate and encapsulated by resin to produce a temporary wafer, then the chips can be handled more easily, but additional processing steps and materials are required
Solution Approach 1:
The patent extracts and removes the support substrate from the final product after the chips have been bonded together. The support substrate serves only as a temporary carrier during manufacturing processes, enabling easy handling of thin chips without becoming part of the final device structure. This extraction approach simplifies the final product while maintaining manufacturing ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the easy and stable fabrication of extremely thin laminated device chips, facilitating their handling and bonding, even at thicknesses of 10 μm or less, by supporting the wafers during processing and reducing adhesive strength for peeling.
Implementation Method 1
a preparing step of preparing a first device wafer... an integrating step of affixing a support substrate to a face side of the first device wafer
Implementation Method 2
a thinning step of processing the first device wafer from a reverse side thereof to thin down the first device wafer to a predetermined thickness
Implementation Method 3
an affixing step of affixing the first device wafer as cut to the second device wafer
Implementation Method 4
a peeling step of peeling the support substrate from the first device wafer as cut... by applying a laser beam through the tape and the support substrate to the adhesive to reduce the bonding strength of the adhesive
Data Source
AI summary
A method of manufacturing laminated device chips includes affixing a support substrate to a face side of a first device wafer, processing the first device wafer from a reverse side thereof to thin down the first device wafer to a predetermined thickness, forming cut grooves in the first device wafer thereby to cut the first device wafer, affixing the first device wafer to a second device wafer, peeling off the support substrate from the first device wafer, and dividing the second device wafer into a plurality of laminated device chips.