Laminated Circuit Pattern Structure for Higher Conductor Density
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Solution Overview
Problem
Conventional methods for manufacturing laminated electronic components face limitations in increasing the ratio of conductor patterns to thickness in the interlayer direction, as the interval between conductor patterns is restricted by the presence of insulating substrates, leading to reduced efficiency and performance.
Innovation Solution
The solution involves forming a first and second circuit pattern with a via connection, where the end portion of the second circuit pattern on the lower side in the interlayer direction has a narrowing width, and using photolithography to create a second circuit pattern trench with a bottom portion that narrows as depth increases, allowing for a thinner insulating material thickness and improved close contact with the insulator, thereby increasing the conductor-to-thickness ratio.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of stacked layers is increased using conventional sandwich structure, then the conductor pattern density increases, but the interval between conductor patterns cannot be narrowed due to insulating substrate thickness
Solution Approach 1:
The insulating layer thickness is made non-uniform, being thin at the ends where conductor patterns are located and thick in the middle. This local variation allows conductor patterns to be positioned closer together at the ends while maintaining adequate insulation where needed, thereby narrowing the interval between conductor patterns and increasing conductor density.
Solution Approach 2:
The insulating layer thickness is varied in the vertical dimension (interlayer direction) to create a three-dimensional structure. By making the insulating layer thin at specific locations (ends) and thick in others (middle), the design achieves closer conductor spacing in the horizontal dimension without compromising insulation requirements.
2Quantity of substance
If the second insulating layer is made thin to increase conductor ratio, then the conductor-to-thickness ratio improves, but the insulating layer swells and becomes wavy when conductor protrudes
Solution Approach 1:
The insulating layer is designed with sufficient thickness in advance at critical locations to accommodate and absorb the protrusion of conductor patterns. This pre-planned thickness variation prevents the insulating layer from becoming wavy or unstable, as the conductor is already contained within the designed thickness envelope.
Solution Approach 2:
The insulating layer thickness is optimized locally - thin where conductor protrusion is minimal and adequately thick where conductor protrusion occurs. This localized thickness adjustment maintains insulating layer flatness and stability while still achieving an overall high conductor-to-thickness ratio.
3Stability of the object's composition
If the insulating layer thickness is increased to prevent swelling, then the insulating layer stability improves, but the conductor-to-thickness ratio decreases
Solution Approach 1:
Rather than uniformly increasing insulating layer thickness throughout, the design applies thickness variations locally - making the insulating layer thin at ends where conductor patterns are positioned and adequately thick in the middle. This selective approach maintains insulating layer stability where needed while maximizing conductor-to-thickness ratio overall.
Solution Approach 2:
The solution moves from a two-dimensional uniform thickness approach to a three-dimensional variable thickness approach. By controlling insulating layer thickness in the vertical dimension at different horizontal positions, the design achieves both stability and high conductor ratio simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the ratio of conductors to thickness in the interlayer direction, improves close contact properties, and reduces DC electric resistance, resulting in a more efficient and high-performance laminated electronic component.
Implementation Method 1
a photosensitive insulating material is formed so as to cover the first circuit pattern
Data Source
AI summary
An electronic component capable of increasing a ratio of a conductor to a thickness in an interlayer direction. An electronic component includes a first circuit pattern and a second circuit pattern stacked in this order from a lower side to an upper side in an interlayer direction; and an insulator disposed between the first circuit pattern and the second circuit pattern. In the second circuit pattern, an end portion on the lower side in the interlayer direction has a shape in which a width, which is a dimension perpendicular to the interlayer direction, narrows as the width is positioned on the lower side in the interlayer direction in sectional view of a section including the interlayer direction.