Laminated Circuit Filter With Embedded IR Attenuation Layer
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Solution Overview
Problem
Existing laminated circuit assemblies in quantum computing systems face challenges in effectively filtering and attenuating signals of different frequencies, particularly infrared signals, which can disrupt communication and increase thermal loading, while also requiring compact and scalable configurations.
Innovation Solution
A laminated circuit assembly with a frequency absorbent material in a cavity within the substrate, configured to provide less attenuation to lower frequencies and greater attenuation to higher frequencies, including infrared signals, while maintaining signal integrity and scalability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If frequency absorbent material is added to filter infrared signals, then attenuation of high frequency signals is improved, but device complexity increases
Solution Approach 1:
The patent combines the filter portion and dielectric portion into a single integrated substrate structure. The frequency absorbent material is embedded within the substrate itself rather than being a separate component, merging the filtering function with the substrate's structural and dielectric functions. This integration achieves infrared signal attenuation while avoiding additional discrete components.
Solution Approach 2:
The substrate is designed to serve multiple functions simultaneously: it provides dielectric properties for signal transmission, structural support, and infrared filtering through the embedded frequency absorbent material. The filter portion and dielectric portion both contribute to these multiple functions, allowing a single component to replace what would traditionally require separate elements.
2Volume of moving object
If filter portion is embedded within substrate, then compact configuration is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The cavity containing the frequency absorbent material is formed within the substrate during the substrate fabrication process itself, before final assembly. This preliminary formation of the filter portion integrated into the substrate structure allows for precise positioning and reduces the need for subsequent alignment operations, thereby managing manufacturing precision requirements while achieving compact integration.
3Reliability
If frequency absorbent material is used, then signal communication quality is improved, but thermal loading increases
Solution Approach 1:
The frequency absorbent material is placed locally within specific cavities in the substrate where infrared filtering is most needed, rather than uniformly throughout the entire substrate. This localized placement provides targeted signal communication protection while minimizing the total volume of material that could contribute to thermal loading, thus balancing reliability improvement with thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances signal communication by improving attenuation characteristics, reduces thermal interference, and enables compact, scalable implementations suitable for quantum computing systems.
Implementation Method 1
The filter portion can include an absorptive material configured to provide less attenuation to signals of a first frequency and greater attenuation to signals of a second, different frequency
Data Source
AI summary
A laminated circuit assembly for filtering signals in one or more signal lines in, for instance, a quantum computing system is provided. In one example, the laminated circuit assembly includes one or more signal lines disposed within a substrate in a first direction. The laminated circuit assembly includes a dielectric portion of the substrate. The laminated circuit assembly includes a filter portion of the substrate extending in a first direction and containing a frequency absorbent material providing less attenuation to a first signal of a first frequency than to a second signal of a second, higher frequency. The filter portion is configured to attenuate infrared signals passing through the one or more signal lines.