Laminated Coil Layout With Overlapping Conductors to Prevent Cracks

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Solution Overview

Problem

The laminated inductor design in existing technologies is prone to localized density reduction and crack formation due to regions where coil patterns do not overlap, leading to potential defects.

Innovation Solution

A laminated coil component design with specific overlapping configurations of coil conductors, including first and second laminated portions with parallel sections connected via via conductors, ensuring all conductors in these sections overlap when viewed from the lamination direction, and intermediate portions with non-overlapping conductors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If coil patterns are arranged in parallel sections with overlapping configurations, then structural integrity is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvestructural integrityVSAvoidcoil conductor arrangement complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The coil conductors are divided into multiple parallel sections (first parallel section, second parallel section, third parallel section) that are segmented along the lamination direction. Each section contains a specific number of coil conductors (three, two, and one respectively) that are electrically connected in parallel. This segmentation allows the structure to maintain integrity while simplifying the arrangement complexity by creating modular units.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent utilizes the lamination direction (vertical dimension) to arrange coil conductors in multiple layers, creating a three-dimensional configuration. When viewed from the lamination direction, the coil conductors in different parallel sections overlap with each other, effectively using the vertical dimension to achieve both structural integrity and electrical connectivity without increasing horizontal complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Stability of the object's composition

If coil conductors are arranged to overlap in parallel sections, then density uniformity is improved, but device complexity increases

Engineering Contradiction:
Improvedensity uniformityVSAvoidlaminated structure complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

Different regions of the laminated structure have different coil conductor configurations. The first parallel section has three coil conductors, the second has two, and the third has one, creating local variations in conductor density. However, when viewed from the lamination direction, these local variations overlap to create a more uniform overall density distribution, preventing localized density reduction that would lead to cracks.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs the lamination direction as an additional dimension to achieve density uniformity. By arranging coil conductors in multiple layers that overlap when viewed from the lamination direction, the structure compensates for density variations in individual layers, creating a uniformly dense three-dimensional configuration that prevents crack formation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If parallel sections are connected via via conductors, then electrical connectivity is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improveelectrical connectivityVSAvoidvia conductor alignment precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The electrical connection between parallel sections is achieved through segmented via conductors that connect corresponding coil conductors across different layers. Each via conductor connects specific coil conductors in sequence (first to second parallel section, and second to third parallel section), creating a modular connection system that improves reliability while managing precision requirements through systematic alignment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The via conductors are arranged to connect coil conductors in the lamination direction, utilizing the vertical dimension for electrical connectivity. This three-dimensional connection approach allows for improved electrical connectivity between parallel sections while the systematic overlap arrangement helps maintain alignment precision by providing reference points for via conductor placement.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12592335B2Laminated coil component
Publication Date: 2026.03.31 MURATA MFG CO LTD
  • US12592335B2 patent drawing
  • US12592335B2 patent drawing
  • US12592335B2 patent drawing

AI summary

A laminated coil component includes an element body including insulating layers laminated in a lamination direction, a coil inside the element body, and an external electrode on a surface of the element body and electrically connected to the coil. The coil includes a coil conductors laminated in the lamination direction and electrically connected via a via conductor penetrating the insulating layer in the lamination direction. The coil conductors include a first laminated portion including three or more of the coil conductors adjacent to each other, a second laminated portion including the coil conductors adjacent to each other such that a number of the coil conductors in the second laminated portion is the same as a number of the coil conductors in the first laminated portion, and an intermediate portion adjacent to and between the first and second laminated portions and including one or two of the coil conductors.