Laminated Coil Component Manufacturing via Photolithography
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Solution Overview
Problem
Existing methods for manufacturing laminated coil components face issues with lamination shift and collapse of conductor patterns, particularly when forming conductor patterns using printing methods, which can lead to inaccuracies and reduced quality factors in the coil.
Innovation Solution
The method involves forming conductor and element patterns using photolithography on separate base materials, allowing for precise alignment and lamination without overlap, followed by thermal treatment to enhance the rectangular shape of the conductor patterns and improve the Q factor of the coil.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a printing method is used to form a conductor pattern on a base material, then the manufacturing process is simple and easy to implement, but the conductor pattern spreads in the width direction causing lamination shift and collapse
Solution Approach 1:
The patent replaces the printing method (mechanical application of paste) with a photolithography method (photochemical patterning). This substitution eliminates the spreading issue inherent in printing while achieving precise rectangular conductor patterns through photoresist coating, exposure, and development processes
Solution Approach 2:
The patent changes the fundamental parameter of pattern formation from direct paste printing to photoresist-based photolithography. This parameter change transforms the process from one prone to spreading to one that achieves precise dimensional control through optical exposure and chemical development
2Reliability
If the conductor pattern is formed with a rectangular shape in cross section, then the Q factor of the coil is improved, but the printing method causes the pattern to spread and deform
Solution Approach 1:
The patent replaces the mechanical printing process that causes pattern deformation with a photolithographic process that preserves the intended rectangular shape. The photoresist method allows vertical wall formation without the lateral spreading that occurs in printing
Solution Approach 2:
The patent changes the pattern formation mechanism to achieve the critical parameter of vertical rectangular shape. Photolithography enables precise control of pattern dimensions and aspect ratio, creating the vertical walls necessary for high Q factor coil performance
3Productivity
If adjacent conductor patterns are laminated in the laminating direction, then the coil structure is formed, but lamination shift occurs causing misalignment
Solution Approach 1:
The patent replaces the printing method with photolithography to achieve precise pattern definition. This substitution ensures that conductor patterns maintain their exact positions and dimensions through the lamination process, preventing misalignment while enabling efficient coil structure formation
Solution Approach 2:
The patent changes the pattern formation process to achieve precise dimensional control and position accuracy. Photolithography provides the necessary precision for pattern alignment during lamination, ensuring that conductor patterns from different layers align correctly to form the coil structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses lamination shift and collapse, achieving a more accurate rectangular shape for the conductor patterns and improving the quality factor of the coil by ensuring precise alignment and thermal treatment of the laminated layers.
Implementation Method 1
a step of forming a conductor pattern including a configuration material of the conductor on a first base material by a photolithography method, a step of forming an element pattern including a configuration material of the element on a second base material by a photolithography method
Implementation Method 2
a step of performing thermal treatment for a laminate obtained by the step of laminating
Data Source
AI summary
A method for manufacturing a laminated coil component including an element and a conductor configuring a coil in the element includes a step of forming a conductor pattern including a configuration material of the conductor on a first base material by a photolithography method, a step of forming an element pattern including a configuration material of the element on a second base material by a photolithography method, the element pattern being formed such that a shape corresponding to a shape of the conductor pattern has been removed, a step of laminating the conductor pattern and the element pattern in a predetermined direction by repeatedly transferring the conductor pattern and the element pattern onto a support, and a step of performing thermal treatment for a laminate obtained by the step of laminating.