Laminated Coil Substrate via Folded Surface Connections
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Solution Overview
Problem
Existing laminated coil substrates face challenges in achieving high inductance and reliable connections between coil substrates without the need for through-hole conductors, which can be prone to disconnection and require complex manufacturing processes.
Innovation Solution
A laminated coil substrate design featuring a printed wiring board with a resin substrate, multiple coil substrates folded such that their surfaces oppose each other, connected via intersubstrate connection wires on the inner sides to eliminate the need for through-hole conductors, enhancing adhesion and reducing stress on connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-hole conductors are used to connect coil substrates, then electrical connection between substrates is achieved, but reliability decreases due to disconnection risks and manufacturing complexity increases
Solution Approach 1:
The patent extracts and eliminates the through-hole conductor from the connection system. Instead of using through-hole conductors that penetrate the substrate, the invention uses surface-mounted connection wires on the outer surfaces of folded coil substrates. This removal of the through-hole structure eliminates the disconnection risks and manufacturing complexity associated with drilling, plating, and securing through-hole connections.
Solution Approach 2:
The patent transitions from a three-dimensional through-hole connection (penetrating the substrate thickness) to a two-dimensional surface connection. Connection wires are mounted on the outer surfaces of the folded coil substrates, changing the connection dimension from vertical (through the substrate) to horizontal (on the surface). This dimensional change eliminates the need for through-hole processing while maintaining electrical connectivity.
2Reliability
If multiple coil substrates are folded and laminated to achieve high inductance, then inductance increases, but connection reliability between substrates decreases
Solution Approach 1:
The patent uses surface-mounted connection wires on the outer surfaces of folded substrates instead of through-hole connections. This dimensional change allows reliable electrical connection between laminated coil substrates without the disconnection risks of through-hole conductors, enabling high inductance achievement through multiple folded layers.
Solution Approach 2:
The connection wires are pre-formed and positioned on the outer surfaces of the coil substrates before folding and lamination. This preliminary positioning ensures that connections are established in optimal locations, maintaining reliability while enabling the folded multi-layer structure required for high inductance.
3Ease of manufacture
If through-hole conductors are used for substrate connections, then electrical connectivity is achieved, but manufacturing process complexity increases
Solution Approach 1:
The patent removes the through-hole conductor element entirely from the manufacturing process. Connection is achieved through surface-mounted wires on folded substrates, eliminating the complex steps of drilling holes, applying plating, inserting conductors, and securing them. This extraction dramatically simplifies the manufacturing process while maintaining connectivity.
4Strength
If connection wires are placed on outer surfaces of folded substrates, then adhesion strength increases and disconnection risk decreases, but manufacturing precision requirements increase
Solution Approach 1:
Connection wires are pre-formed and positioned on the outer surfaces of coil substrates before the folding and lamination processes. This preliminary positioning allows for controlled placement with appropriate precision, and the subsequent folding and lamination steps secure the wires in their predetermined locations, achieving both strong adhesion and acceptable manufacturing precision.
Data Source
AI summary
A laminated coil substrate includes a printed wiring board including a resin substrate, a first conductor layer on first surface of the substrate and including coils, and a second conductor layer formed on second surface of the substrate on the opposite side and including coils. The printed wiring board includes first, second and third coil substrates that are folded such that the second surface of the substrate in the first and second coil substrates oppose each other and that the first surface of the substrate in the second and third coil substrates oppose each other, the second conductor layer of the printed wiring board includes connection wire on the second surface of the substrate and connecting the first and second coil substrates, and the first conductor layer of the printed wiring board includes connection wire on the first surface of the substrate and connecting the second and third coil substrates.