Laminated Electronic Component Bottom Terminal Insulation
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Solution Overview
Problem
Conventional laminated electronic components face challenges in high-density mounting due to solder bridges and difficulties in maintaining desired inductance and DC superimposition characteristics, especially when miniaturized, and the use of insulator films complicates accurate formation and increases component thickness.
Innovation Solution
A method of manufacturing laminated electronic components by forming a collective laminated body with insulator or magnetic material layers and conductor patterns, creating external terminals, applying a disappearing layer that vanishes via heat treatment, cutting into individual bodies, and applying an insulator precursor to form a component with lead-out ends connected via conductors, ensuring accurate insulation and high-density mounting without degrading characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If external terminals are formed on the longitudinal-direction side surfaces of the laminated body, then the component can be connected to external terminals, but solder bridges are formed between adjacent electronic components causing short circuits and making high-density mounting difficult
Solution Approach 1:
The patent moves the external terminals from the side surfaces (longitudinal direction) to the bottom surface of the laminated body. This dimensional relocation allows terminals to be positioned in a plane that does not create solder bridge risks with adjacent components, enabling high-density mounting while maintaining reliable electrical connections.
2Reliability
If an insulator film is formed after external terminals are formed to prevent solder bridges, then solder bridge prevention is achieved, but the component thickness increases and accurate formation of the insulator film becomes difficult
Solution Approach 1:
The insulator film is formed on the bottom surface before the external terminals are created. This preliminary formation ensures that the insulator film is accurately positioned and formed without the complications of subsequent coating, while still providing the necessary insulation to prevent solder bridges.
Solution Approach 2:
Instead of forming the insulator film after terminals (conventional approach), the patent inverts the sequence by forming the insulator film first on the bottom surface, then creating terminals on top of or through the insulator film. This reversal simplifies the insulator film formation process and improves manufacturing precision.
3Reliability
If the insulator film goes around to the bottom surface to provide insulation, then solder bridge prevention is achieved, but the component easily deviates from the land pattern of the mounting board
Solution Approach 1:
The insulator film is applied locally to specific areas of the bottom surface where insulation is needed, rather than forming a complete wraparound coating. This localized insulation approach prevents solder bridges while maintaining accurate alignment with the mounting board's land pattern, as the insulator film does not extend beyond the necessary boundaries.
4Volume of moving object
If the component is miniaturized to achieve high-density mounting, then mounting density is improved, but maintaining desired inductance and DC superimposition characteristics becomes difficult
Solution Approach 1:
The patent relocates terminals to the bottom surface, which changes the current path geometry and allows for optimized conductor routing within the laminated structure. This dimensional change enables better utilization of the limited space in miniaturized components while maintaining the magnetic flux path length and cross-sectional area needed for desired inductance and DC superimposition characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-density mounting with improved DC superimposition, insulation, and withstand voltage characteristics while maintaining component accuracy and reducing the risk of solder bridges by covering conductors with an insulator film, thus enhancing the overall performance and reliability of the laminated electronic components.
Implementation Method 1
forming a disappearing layer covering the external terminals and caused to disappear by heat treatment on the surface of the collective laminated body
Implementation Method 2
forming a laminated electronic component by applying a heat treatment to the element body to which the insulator precursor is applied
Data Source
AI summary
A method of manufacturing a laminated electronic component having a circuit element formed in an element body. The method includes forming a collective laminated body including a plurality of element bodies having circuit elements formed therein by laminating pluralities of insulator layers and conductor patterns; forming a plurality of external terminals on one of surfaces of the collective laminated body orthogonal to a lamination direction; forming a disappearing layer covering the external terminals and caused to disappear by heat treatment; cutting and dividing the collective laminated body having the disappearing layer formed thereon along the lamination direction into each of element bodies; applying an insulator precursor to a surface of the element body; and forming a laminated electronic component by applying a heat treatment to the element body to which the insulator precursor is applied. In the method, the insulator layers can be replaced by magnetic material layers.