Laminated Component Carrier with Vertical Impedance Matching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional component carriers for high-frequency applications face challenges with heat removal, mechanical robustness, electrical reliability, and signal loss, particularly due to increasing miniaturization and the need for compact designs.
Innovation Solution
A component carrier with a laminated stack comprising electrically conductive and insulating layers, a front-end chip, an antenna interface, and impedance matching circuitry arranged vertically to minimize signal loss and maximize mechanical and electrical reliability, featuring a compact, thermally efficient design with integrated antenna and impedance matching capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional component carriers are used for high-frequency applications, then signal transmission is achieved, but signal loss is significant
Solution Approach 1:
The patent transitions from conventional planar signal routing to a three-dimensional laminated stack architecture. The signal path is routed through multiple conductive layers stacked vertically, with impedance matching circuitry embedded within the stack. This vertical integration reduces the overall signal path length and minimizes exposure to lossy environments, thereby reducing signal loss while maintaining electrical reliability for high-frequency applications.
Solution Approach 2:
The impedance matching circuitry is nested within the laminated stack structure, with conductive layers and insulating layers arranged in a nested configuration. The signal path is embedded within the nested layers, allowing the impedance matching circuitry to be closely integrated with the signal transmission path. This nesting reduces the distance between components and minimizes signal loss.
2Volume of moving object
If electronic components are miniaturized with smaller spacing, then device compactness is improved, but heat removal becomes increasingly difficult
Solution Approach 1:
The laminated stack structure provides localized thermal management by distributing heat-generating components across multiple layers. The conductive and insulating layers are arranged to create localized thermal pathways, allowing heat to be conducted away from dense component regions through the layered structure. This local quality approach enables effective heat removal despite miniaturization and increased component density.
3Adaptability or versatility
If array-like components with multiple contacts are used, then functionality is increased, but mechanical robustness and electrical reliability are compromised
Solution Approach 1:
The patent moves from two-dimensional component arrangements to a three-dimensional laminated stack configuration. Multiple contacts and connections are distributed across vertical layers rather than being confined to a single plane. This vertical distribution reduces mechanical stress on individual contacts and improves overall structural robustness while maintaining the high functionality required by array-like components.
Data Source
AI summary
A component carrier has a laminated stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a front-end chip on and/or in the stack and extending at least up to a main surface of the stack, an antenna interface on an opposing other main surface of the stack, and an impedance matching circuitry in the stack and arranged vertically between the front-end chip and the antenna interface.