Laminated Electronic Component High-Young's Modulus Cover Layer Vibration
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Solution Overview
Problem
Existing methods for suppressing acoustic noise in laminated electronic components, such as those using metallic terminals or specific mounting structures, are inefficient due to complex manufacturing and mounting processes.
Innovation Solution
A laminated electronic component with a high-Young's modulus cover layer, higher than the dielectric layers, is used, along with external electrodes connected to internal electrodes, and mounted on a substrate with the high-Young's modulus layer facing the substrate to reduce vibration and acoustic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a low-permittivity material or internal electrode pattern is used to reduce electrostrictive effect, then vibration of the electronic component is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies local quality by introducing a cover layer with specifically optimized properties (different from the dielectric layers) at the surface of the electronic component. This cover layer has a Young's modulus and Poisson's ratio designed to suppress vibration, while the internal dielectric layers maintain their original electrostrictive characteristics for electrical functionality. This resolves the contradiction by achieving vibration reduction through localized structural modification rather than changing the entire component's material composition or electrode pattern.
Solution Approach 2:
The patent employs composite materials by combining the dielectric layers with a cover layer having different mechanical properties. The cover layer is made of a material whose Young's modulus and Poisson's ratio are specifically selected to suppress vibration, creating a composite structure that maintains electrical functionality while reducing acoustic noise. This approach avoids the complexity of modifying internal electrode patterns or using low-permittivity materials throughout the entire component.
2Object-affected harmful factors
If metallic terminals or lead are used to absorb vibration, then vibration attenuation is achieved, but the manufacturing and mounting process becomes complicated
Solution Approach 1:
The patent extracts the vibration suppression function from the mounting structure and external terminals and integrates it directly into the electronic component itself through the cover layer. Instead of relying on external metallic terminals or complex mounting arrangements to absorb vibration, the cover layer provides inherent vibration suppression as an intrinsic property of the component. This eliminates the need for additional vibration-absorbing elements and simplifies both manufacturing and mounting processes.
Solution Approach 2:
The electronic component serves its own vibration suppression needs through the cover layer, which is an integral part of the component structure. The cover layer automatically suppresses vibration generated by the dielectric layers during operation, without requiring external vibration-absorbing elements or complex mounting arrangements. This self-service approach simplifies the overall system by eliminating the need for additional vibration control measures.
3Object-affected harmful factors
If the height of solder fillet is adjusted to restrain vibration transmission, then vibration attenuation is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent extracts the vibration suppression function from the solder joint and mounting structure and relocates it to the electronic component's cover layer. Instead of relying on precise control of solder fillet height to achieve vibration attenuation, the cover layer provides inherent vibration suppression that is independent of mounting details. This resolves the contradiction by eliminating the need for high-precision solder fillet control while still achieving effective vibration restraint.
Solution Approach 2:
The electronic component with its specialized cover layer serves its own vibration suppression needs independently of the mounting structure. The cover layer's mechanical properties are designed to suppress vibration regardless of solder fillet height or mounting conditions, thereby eliminating the need for tight manufacturing precision controls on solder joints. This self-service capability decouples vibration suppression performance from mounting precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses acoustic noise by reducing spreading vibration and achieving a significant reduction in sound pressure levels, as demonstrated by simulation and measurement data.
Implementation Method 1
the first cover layer comprising a high-Young's modulus layer which is higher in Young's modulus than the dielectric layers
Implementation Method 2
when DC voltage and AC voltage are simultaneously applied to the electronic component, strain occurs in the dielectric layer due to the electrostrictive effect of a dielectric, causing vibration in the electronic component in itself
Data Source
AI summary
A laminated electronic component includes a main body including an effective layer in which dielectric layers and internal electrode layers are alternately laminated, and a pair of a first cover layer and a second cover layer which are disposed on opposite sides, respectively, in a stacking direction of the effective layer; and a plurality of external electrodes disposed on an outer surface of the main body. The internal electrode layers are alternately connected to the different external electrodes, and the first cover layer has a high-Young's modulus layer which is higher in Young's modulus than the dielectric layers. By mounting such a laminated electronic component to a substrate so that the first cover layer and a mounting face of the substrate are opposed to each other, it is possible to suppress acoustic noise.