Laminated Electronic Component Fine Grain Plating
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Solution Overview
Problem
In laminated ceramic capacitors, reducing the thickness of the ceramic layer to achieve smaller size and larger capacity leads to increased risk of short circuits and reliability issues due to the conventional method of forming external terminal electrodes using conductive paste, which results in thicker electrodes and compromised insulation resistance when using direct plating with larger grain sizes.
Innovation Solution
The formation of external terminal electrodes through direct plating with a plating film having an average grain diameter of 0.1 μm or less, utilizing a triple-layered structure including Cu, Ni, and Sn plating films to enhance surface area, continuity, and durability, effectively preventing water ingress and maintaining reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the ceramic layer is reduced to achieve smaller size and larger capacity, then the size of the capacitor is reduced and capacity is increased, but the risk of short circuit between internal electrodes increases
Solution Approach 1:
The patent changes the parameter of ceramic layer thickness to achieve miniaturization while maintaining reliability through improved external terminal electrode design. The external terminal electrode structure is optimized to provide sufficient insulation resistance even with reduced ceramic thickness, preventing short circuits between internal electrodes.
2Quantity of substance
If the effective area of internal electrode is increased to achieve larger capacity, then the capacity is increased, but the area of ceramic layer must be increased to provide margins for misalignment, which is limited by the thickness of external terminal electrode
Solution Approach 1:
The patent optimizes the parameters of the external terminal electrode, particularly its thickness and composition, to reduce the required ceramic layer area. By improving the electrode structure, sufficient insulation is achieved with smaller margins, allowing increased internal electrode area within the same overall component dimensions.
3Volume of moving object
If direct plating is used to form external terminal electrode to reduce electrode thickness, then the electrode thickness is reduced and volume is decreased, but when average grain diameter of metal grains is increased, water enters through gaps between electronic component body and plating film
Solution Approach 1:
The patent optimizes the grain diameter parameter of the plating film to balance electrode thickness reduction with reliability maintenance. By controlling the metal grain size in the direct plating process, sufficient density and continuity are achieved to prevent water ingress while maintaining thin electrode thickness for miniaturization.
4Volume of moving object
If thickness of plating film is reduced to achieve thinner electrode, then the electrode thickness is reduced, but the continuity of plating film is deteriorated due to reduced smoothness
Solution Approach 1:
The patent optimizes multiple parameters of the direct plating process including plating bath composition, temperature, current density, and duration to achieve smooth, continuous plating films at reduced thicknesses. These parameter adjustments ensure adequate film continuity and smoothness even when the plating film is made thinner for miniaturization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a laminated electronic component with improved reliability and durability, as the small grain size plating film effectively fills gaps and maintains continuity, even with reduced thickness, enhancing the insulation resistance and sealing performance.
Implementation Method 1
a plating film precipitates on an exposed portion of an internal electrode in a ceramic base material end surface as a nucleus, and the exposed portions of the neighboring internal electrodes are connected to each other as a result of growth of the plating film
Data Source
AI summary
A laminated electronic component includes a component body including a plurality of laminated functional layers, a plurality of internal conductors provided inside the component body, and an external terminal electrode that is electrically connected to an internal conductor via an exposed portion of the internal conductor and that is defined by a direct plating film. An average grain diameter of metal grains defining the plating film is about 0.1 μm or less.