Laminated Electronic Component Mounting Stability via Localized Electrodes
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Solution Overview
Problem
Laminate-type electronic components are prone to instability and inclination on a circuit board due to the absence of external electrodes on surfaces other than the mounting surface, leading to uneven solder distribution and potential short circuits during dense mounting.
Innovation Solution
The electronic component features a laminated body with a mounting surface having depressions for external electrodes formed by plating, which are thinner than the depressions, ensuring stable attachment and preventing inclination by allowing solder to fill these depressions, thus enhancing stability and preventing whisker formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If no external electrode is provided on surfaces other than the mounting surface, then solder does not attach to side surfaces forming fillets, allowing dense mounting, but the component becomes unstable and inclined during mounting due to lack of fillet formation
Solution Approach 1:
The patent applies local quality by providing external electrodes only on specific surfaces (mounting surface and at least one adjacent side surface) rather than uniformly on all surfaces. This localized electrode configuration allows fillet formation only on designated side surfaces, creating asymmetric solder distribution that enhances mounting stability while preserving dense mounting capability through selective fillet placement.
2Reliability
If external electrodes are provided on all surfaces, then stable mounting is achieved through fillet formation, but solder spreads horizontally preventing dense mounting
Solution Approach 1:
The patent selectively positions external electrodes on the mounting surface and specific adjacent side surfaces, creating localized fillet formation zones. This prevents horizontal solder spread to adjacent components while maintaining stable mounting through controlled fillet placement, thereby enabling both mounting stability and high mounting density.
3Productivity
If no fillet is formed during mounting, then dense mounting is enabled, but the component floats on melted solder causing inclination due to external vibrations
Solution Approach 1:
The patent creates localized fillet formation on specific side surfaces where external electrodes are provided, generating asymmetric solder distribution. This localized anchoring prevents the component from floating on melted solder during reflow, thereby eliminating inclination caused by external vibrations while maintaining the ability to mount components densely.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents the electronic component from tilting on the circuit board during and after mounting, ensuring stability under external vibrations and reducing the likelihood of short circuits between adjacent components during dense mounting.
Implementation Method 1
an external electrode provided in the depression and formed directly by plating
Data Source
AI summary
An electronic component that is prevented from being inclined with respect to a circuit board during and after mounting includes a laminated body that is preferably configured by stacking a plurality of insulator layers, and includes a lower surface with depressions provided thereon. The lower surface includes a series of outer edges of the insulator layers. Capacitor electrodes are defined by internal conductors incorporated in the laminated body, which respectively have exposed sections that are exposed from between the insulator layers in the depressions on the lower surface. External electrodes, which are preferably formed directly by plating, are provided in the depressions to cover the exposed sections.