Laminated Electronic Component Plating Film Moisture Resistance
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Solution Overview
Problem
The miniaturization of laminated ceramic capacitors is hindered by the risk of short-circuiting and reduced moisture resistance due to thin ceramic layers and the limitations of conventional external terminal electrode formation methods, which compromise the reliability of the components.
Innovation Solution
The formation of external terminal electrodes through direct plating with a substrate plating film having an average particle diameter of at least 1.0 μm, which reduces moisture intrusion paths and enhances moisture resistance, combined with additional plating films for improved characteristics such as solder-barrier and wettability functions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the ceramic layer is reduced to achieve miniaturization, then the size of the capacitor is reduced, but short-circuiting between internal electrodes readily occurs and quality cannot be ensured
Solution Approach 1:
The patent changes the particle size parameter of the plating film from conventional fine particles to coarse particles with average diameter of 1.0 μm or more. This parameter change creates a plating film with larger pore structures that provides better moisture resistance while maintaining electrical conductivity, allowing thin ceramic layers to be used without compromising quality
2Area of stationary object
If the area of the ceramic layer is increased to provide side margin and end margin for deviations, then the effective area for margins is improved, but the area of the ceramic layer cannot be increased further within dimensional standards and thickness of external terminal electrode prevents increase
Solution Approach 1:
The patent changes the thickness parameter of the external terminal electrode by forming a thin plating film through direct plating with coarse particles. This reduces the electrode thickness to 10 μm or less, thereby increasing the available ceramic layer area while still providing sufficient margins for lamination and cutting deviations
3Manufacturing precision
If direct plating is used to form external terminal electrode, then a thin, flat electrode film can be formed, but the thickness of the plating film is relatively small and moisture and other contaminants can intrude easily, deteriorating reliability in moisture-resistance at high temperatures
Solution Approach 1:
The patent changes the particle size parameter of the plating film from fine particles to coarse particles with average diameter of 1.0 μm or more. This creates a plating film with larger pore structures that surprisingly provides better moisture resistance at high temperatures while maintaining the thin and flat characteristics needed for manufacturing precision
Solution Approach 2:
The patent uses a composite plating film structure combining coarse metal particles with a binder material. This composite structure creates a porous network that provides both electrical conductivity and enhanced moisture resistance at high temperatures, resolving the contradiction between thin film formation and moisture protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves the moisture resistance and reliability of laminated electronic components by reducing moisture intrusion paths and providing enhanced functional characteristics, thereby addressing the challenges of miniaturization and performance in ceramic capacitors.
Implementation Method 1
the external terminal electrode includes a substrate plating film disposed on the outer surface of the electronic component main body by direct plating so as to cover the exposed portions of the internal conductors
Data Source
AI summary
A method for manufacturing a laminated electronic component including an electronic component main body including laminated functional layers, internal conductors which are disposed inside the electronic component main body and a portion of which are exposed portions exposed at outer surfaces of the electronic component main body, and external terminal electrodes disposed on the outer surfaces of the electronic component main body so as to connect to the internal conductors and cover the exposed portions of the internal conductors includes the step of forming a substrate plating film having an average particle diameter of metal particles of at least about 1.0 μm on the outer surface of the electronic component main body through direct plating so as to cover the exposed portions of the internal conductors in the formation of the external terminal electrodes on the electronic component main body.