Laminated Electronic Component Shield Conductor Formation
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Solution Overview
Problem
High-density mounting of electronic components leads to noise interference issues due to inadequate shielding, where the formation of a shield conductor layer on laminated electronic components is hindered by plating layers, resulting in defective formation and potential breakage, which affects the shielding function.
Innovation Solution
A laminated electronic component design where a second plating layer is formed on the side surface to cover exposed internal electrode ends, with a thickness less than the shield conductor layer, and flattened using a barrel apparatus to prevent obstruction and ensure strong bonding, allowing for effective shield conductor layer formation and improved shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plating layer is formed on the end portion of the extended electrode exposed on the side surface of the laminate, then the external electrode surface is protected and solder wettability is improved, but the plating layer becomes an obstacle that causes defective formation of the shield conductor layer
Solution Approach 1:
The patent applies preliminary action by forming the plating layer on the end portion of the extended electrode before forming the shield conductor layer. This sequence is intentionally designed so that the plating layer does not interfere with shield conductor formation. The plating layer is formed first on the exposed end portion, then the shield conductor layer is formed over it, ensuring both protective function and manufacturing quality.
Solution Approach 2:
The patent uses the plating layer as an intermediary between the extended electrode and the shield conductor layer. Rather than removing the plating layer or preventing its formation, the invention allows the plating layer to remain as an intermediate layer that provides both protection to the extended electrode and a suitable substrate for the shield conductor layer, resolving the conflict between protection and manufacturing quality.
2Object-affected harmful factors
If the shield conductor layer is formed on the outer surface of the laminate including the plating layer, then noise shielding is achieved, but the plating layer may break away from the end portion of the extended electrode
Solution Approach 1:
The patent forms the plating layer on the end portion of the extended electrode before forming the shield conductor layer. This preliminary formation ensures that the plating layer is already bonded to the extended electrode before the shield conductor layer is applied, preventing subsequent breakage. The sequence of operations is critical to maintaining bonding strength while achieving shielding.
Solution Approach 2:
The patent merges the functions of the plating layer and shield conductor layer into a unified structure. The plating layer serves dual purposes: protecting the extended electrode and serving as the base for the shield conductor layer. This merging eliminates the need for separate protective measures and ensures integrated bonding strength throughout the structure.
3Strength
If a second plating layer is formed on the side surface to cover the end portion of the internal electrode, then bonding strength is improved, but the thickness of the second plating layer may obstruct shield conductor formation
Solution Approach 1:
The patent applies parameter changes by controlling the thickness of the second plating layer formed on the side surface. The thickness is optimized to provide sufficient bonding strength while remaining thin enough not to obstruct the formation of the shield conductor layer. This parameter optimization resolves the contradiction between strength and manufacturing quality.
Solution Approach 2:
The patent applies local quality by forming the second plating layer with different thickness characteristics at different locations. The plating layer is thicker at the end portion of the internal electrode to provide bonding strength, but thinner in areas where the shield conductor layer will be formed, ensuring no obstruction. This localized variation in thickness resolves the contradiction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents the second plating layer from hindering shield conductor formation and breakage, ensuring a high shielding effect by maintaining the integrity of the electrical connection between the shield conductor and ground electrode, thus reducing noise interference.
Implementation Method 1
flattened using a barrel apparatus to prevent obstruction
Implementation Method 2
a second plating layer is formed on the side surface to cover the end portion of the internal electrode
Implementation Method 3
forming a shield conductor layer on an outer surface of a laminate so that the electronic component does not interfere with another adjacent electronic component
Data Source
AI summary
Provided is a laminated electronic component in which defective formation is unlikely to cause in a shield conductor layer on a side surface of a laminate. The laminated electronic component includes a laminate 1, in which substrate layers 1a to 1i are laminated, having an outer surface including a first main surface 1B, a second main surface 1T, and a side surface 1S, internal electrodes (a ground electrode 2, coil electrodes 3, capacitor electrodes 4, and wiring electrodes 5), an external electrode 7, and a first plating layer 9 formed on a surface of the external electrode 7.