Laminated Electronic Component Conductor Segmentation for Crack Suppression

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Solution Overview

Problem

Laminated electronic components often experience surface cracks due to thermal shrinkage differences between conductor and element body materials, leading to reduced mounting strength.

Innovation Solution

The laminated electronic component features a conductor with an L-shaped exposed face divided by the element body, where each divided region's length exceeds the separation distance, allowing for stress relaxation and increased contact area, thereby suppressing surface cracks and maintaining mounting strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the volume of the conductor is reduced to lower thermal shrinkage, then thermal shrinkage percentage decreases, but mounting strength decreases

Engineering Contradiction:
Improvethermal shrinkage percentageVSAvoidmounting strength
Core Design Contradiction:
Manufacturing precisionVSStrength

Solution Approach 1:

The exposed face of the conductor is divided into multiple divided regions by the element body, which segments the continuous conductor surface into discrete zones. This segmentation allows differential movement and stress distribution, reducing thermal shrinkage effects while preserving overall mounting strength through the distributed structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the conductor are designed with specific geometric characteristics (L-shape, divided regions with controlled dimensions) to optimize local stress distribution. The divided regions have specific length requirements relative to separation distances, creating localized zones that manage thermal expansion differently across the conductor surface.

Inventive Principle:
Principle #3Local quality

2Reliability

If the conductor exposed face is completely divided to suppress cracks, then crack occurrence decreases, but mounting strength may be compromised

Engineering Contradiction:
Improvecrack suppressionVSAvoidmounting strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The complete division of the exposed face into multiple regions creates independent zones that can move independently during thermal cycling, preventing crack propagation while maintaining attachment through the distributed contact points with the element body.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The division that might seem to reduce structural integrity actually converts the harmful continuous stress concentration into beneficial distributed stress patterns, where each divided region manages thermal stress independently, preventing the formation of catastrophic cracks.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Strength

If the length of divided regions is increased to maintain mounting strength, then contact area increases, but stress concentration may increase

Engineering Contradiction:
Improvemounting strengthVSAvoidstress concentration
Core Design Contradiction:
StrengthVSStress or pressure

Solution Approach 1:

The divided regions are designed with specific dimensional relationships where the length of each divided region exceeds the separation distance between regions and the distance to third faces. This creates optimized local zones that distribute stress evenly while maintaining sufficient contact area for mounting strength.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The geometric parameters of the divided regions (length, width, separation distance) are carefully controlled to optimize the balance between contact area and stress distribution. The specific dimensioning ensures that each region is large enough for strong mounting while small enough to avoid excessive stress concentration.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively reduces the occurrence of surface cracks and maintains the mounting strength by dispersing thermal stress and increasing the contact area between the conductor and element body.

Implementation Method 1

cracks are easily caused on the surface of the element body by heat treatment in manufacturing the laminated electronic component because the thermal shrinkage percentage of the constituent material of the conductor is larger than the thermal shrinkage percentage of the constituent material of the element body

Methodology Applied
Scientific EffectThermal shrinkage: Thermal Contraction

Data Source

PatentUS11488761B2Laminated electronic component
Publication Date: 2022.11.01 TDK CORP
  • US11488761B2 patent drawing
  • US11488761B2 patent drawing
  • US11488761B2 patent drawing

AI summary

A laminated electronic component includes an element body and a conductor. The element body is formed by laminating a plurality of element-body layers. The element body has a first face, a second face, and a pair of third faces. The conductor is disposed on the element body and has an L shape. The conductor has an exposed face exposed on the first face and the second face. The exposed face includes a plurality of divided regions divided by the element body. The length of each divided region in a dividing direction is longer than a distance with which the plurality of divided regions is separated from each other and longer than a distance with which the exposed face and the pair of third faces are separated from each other.