Laminated Dressing Board for Semiconductor Wafer Cutting
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Solution Overview
Problem
The frequent replacement of dressing boards during cutting operations, such as in semiconductor wafer processing, is inefficient due to the need for separate boards for shape adjustment and setting, leading to increased downtime and operational costs.
Innovation Solution
A laminated dressing board is used, where a shape adjustment dressing layer and a setting dressing layer are integrated in the thickness direction, allowing the cutting blade to form grooves in each layer sequentially, eliminating the need for board replacement when switching between these operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate dressing boards are used for shape adjustment and setting operations, then each operation can be performed with optimized abrasive grains, but the frequency of dressing board replacement increases
Solution Approach 1:
The patent combines shape adjustment dressing layer and setting dressing layer into a single laminated dressing board. The shape adjustment layer contains abrasive grains for restoring blade geometry, while the setting layer contains abrasive grains for edge sharpness. By laminating these two functional layers together, the system eliminates the need to replace the entire dressing board when switching between shape adjustment and setting operations, thereby reducing replacement frequency and improving operational efficiency while maintaining optimized conditioning quality for each operation type
2Manufacturing precision
If dressing board replacement is performed frequently to switch between shape adjustment and setting, then the appropriate abrasive grains can be used for each operation, but downtime increases
Solution Approach 1:
The patent transitions from horizontal arrangement of separate dressing boards to vertical lamination in the thickness direction. By stacking the shape adjustment dressing layer and setting dressing layer in different vertical layers, the system allows the cutting blade to sequentially dress both layers during a single operational cycle without requiring board replacement. This dimensional reorganization eliminates downtime associated with replacing dressing boards while maintaining the precision benefits of operation-specific abrasive grains
3Adaptability or versatility
If multiple dressing boards are prepared for different cutting blade kinds and purposes, then optimal dressing performance is achieved, but device complexity increases
Solution Approach 1:
The laminated dressing board integrates multiple functions within a single device. The shape adjustment dressing layer addresses geometric restoration needs, while the setting dressing layer addresses edge sharpness needs. This multi-functional integration allows a single dressing board to serve purposes that previously required multiple separate boards, reducing inventory complexity and management burden while maintaining adaptability to different cutting blade kinds and conditioning requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the frequency of dressing board replacements, enhancing operational efficiency and reducing downtime by allowing continuous use of the laminated dressing board for both shape adjustment and setting tasks.
Implementation Method 1
a cutting blade is made to cut into a laminated dressing board
Data Source
AI summary
A method of using a laminated dressing board is provided. In the laminated dressing board, a shape adjustment dressing layer containing first abrasive grains and used for shape adjustment of a cutting blade and a setting dressing layer containing second abrasive grains and used for setting of the shape-adjusted cutting blade are laminated. The method includes a holding step of holding the shape adjustment dressing layer side of the laminated dressing board by a chuck table, a setting dressing step of causing the cutting blade to cut into the laminated dressing board from the setting dressing layer side to form a first groove in the setting dressing layer, and a shape adjustment dressing step of causing the cutting blade to cut into the bottom of the first groove along the first groove to form a second groove in the shape adjustment dressing layer.