Laminated Drive Circuit Board Insulation
Solution Overview
Problem
The existing power conversion devices face challenges in compact design due to the need for maintaining insulation between high-voltage and low-voltage components, leading to increased size and complexity, particularly when using photo-couplers for signal insulation.
Innovation Solution
A laminated board design for the drive circuit board with alternating conductor and insulating layers, where signal transmission elements are integrated within a low voltage system region, and power supply circuits are implemented to overlap with driver circuit regions, allowing for compact construction while ensuring electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If photo-couplers are mounted on external portions around the driver circuit board to ensure signal insulation, then insulation between signal lines and high-potential control terminals is improved, but the driver circuit board size must be increased to maintain certain distances from control terminals
Solution Approach 1:
The patent transitions from a two-dimensional planar layout to a three-dimensional laminated structure with multiple conductor layers separated by insulating layers. This vertical stacking allows signal lines and high-potential control terminals to be insulated by moving them to different layers rather than maintaining horizontal distance, thereby reducing the overall board area while preserving insulation reliability.
Solution Approach 2:
The patent embeds multiple conductor layers within a compact laminated board structure, where each conductor layer is nested between insulating layers. This nesting approach allows multiple circuits operating at different potentials to coexist in a confined space, achieving both compact size and adequate insulation through the layered configuration.
2Reliability
If certain distances are maintained between various circuit portions at different potentials on the driver circuit board to ensure insulation, then insulation between positive and negative potential locations is improved, but the board size increases
Solution Approach 1:
The patent resolves the insulation distance requirement by stacking conductor layers vertically with insulating layers in between. This transforms the insulation problem from a horizontal distance constraint to a vertical layering solution, allowing positive and negative potential locations to be insulated through layer separation rather than requiring large horizontal spacing.
Solution Approach 2:
The patent employs a composite laminated structure combining conductor layers and insulating layers. This composite material approach integrates insulation functionality directly into the board structure itself, eliminating the need for additional clearance and enabling compact design while maintaining insulation between different potential locations.
3Reliability
If certain distances are maintained between circuit portions connected to controller and battery to ensure insulation, then insulation between low-potential and high-potential portions is improved, but the board size increases
Solution Approach 1:
The patent places low-potential and high-potential portions on different conductor layers separated by insulating layers. This vertical separation through lamination provides the required insulation between controller-connected portions and battery-connected portions without requiring increased horizontal distance, thus maintaining compact board size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables a more compact drive circuit board while maintaining effective insulation between components, reducing the overall size of the power conversion device without compromising electrical insulation or noise resistance.
Implementation Method 1
a drive circuit board upon which are implemented, for each phase, an upper arm driver circuit that outputs a drive signal to the upper arm switching element and a lower arm driver circuit that outputs a drive signal to the lower arm switching element; wherein: the drive circuit board is made as a laminated board in which a plurality of conductor layers and a plurality of insulating layers are alternately laminated together
Implementation Method 2
a low voltage system region is formed upon which are implemented signal transmission elements that transmit control signals to each of the driver circuits while electrically insulating the control signals
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Connection portions (225UP through 225W) to which upper arm control terminals (320UU through 320UW) are connected are disposed at a first edge portion of a drive circuit board (22). And connection portions (225sun through 225WN to which lower arm control terminals (320LU through 320LW) are connected are disposed at a second edge portion of the drive circuit board (22) Upper arm implementation regions (227UP through 227WP), lower arm implementation regions (227UN through 227WN), and a low voltage pattern region (228) in which photo-couplers (221U through 221W) are implemented are formed in the board region between these board edge portions. And signal wiring (40U) that transmits a control signal from a photo-coupler (221U) to an implementation region (227UN) is formed in a conductor layer that is a lower layer than the conductor layer in the lower arm implementation region in which the lower arm driver circuit is implemented