Laminated Electronic Component Electroless Plating
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Solution Overview
Problem
Existing methods for manufacturing laminated electronic components face challenges in achieving high effective volume rates, reliability, and cost-effectiveness due to the need for cumbersome processes like applying conductive paste and using expensive metals like Pd and Pt for plating, which also increase the volume and cost of the components.
Innovation Solution
The method involves forming external electrodes using electroless plating deposits directly on the laminated body, eliminating the need for conductive paste and catalysts, and utilizing low-cost metals like Ni, Cu, and Ag for internal electrodes, which allows for compact and homogeneous plating films without the use of high catalytic activity metals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive paste is applied to form external electrodes, then electrical connection is achieved, but the effective volume of the laminated electronic component is reduced
Solution Approach 1:
The invention changes the thickness parameter of the electrode structure by replacing the thick paste electrode layer (tens to hundreds of micrometers) with thin plating layers (a few micrometers), thereby significantly increasing the effective volume while maintaining electrical connection function
Solution Approach 2:
The invention replaces the expensive and thick conductive paste with thin, cost-effective plating layers that achieve the same electrical connection function with minimal volume occupation
2Reliability
If expensive metals like Pd and Pt are used for plating, then wettability and reliability are improved, but manufacturing cost increases
Solution Approach 1:
The invention replaces expensive metals (Pd, Pt) with inexpensive base metals (Ni, Cu, Ag) that can achieve the required wettability and reliability functions through optimized plating processes and multi-layer structures
Solution Approach 2:
The invention uses composite plating structures with multiple layers of different base metals (e.g., Ni-Cu-Sn systems) to achieve the combined benefits of wettability, solderability, and corrosion resistance that previously required expensive noble metals
3Reliability
If multiple process steps including conductive paste application are used, then external electrode formation is achieved, but manufacturing complexity increases
Solution Approach 1:
The invention extracts and eliminates the conductive paste application step from the manufacturing process, using only plating processes to form external electrodes, thereby simplifying the overall manufacturing流程
Solution Approach 2:
The invention merges the functions of paste electrode formation and plating into a single plating-based process, where the plating layers directly provide both the electrical connection and the solderable surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in laminated electronic components with high effective volume rates, high reliability, and reduced costs, as well as the ability to form compact electroless-plating films even with thin internal electrodes, enhancing miniaturization and reducing component size and expense.
Implementation Method 1
forming external electrodes using electroless plating deposits directly on the laminated body
Data Source
AI summary
A laminated body is prepared, in which at an end surface at which internal electrodes are exposed, the internal electrodes disposed adjacently are electrically isolated from each other, and a distance between the internal electrodes disposed adjacently is about 20 μm or less when measured along the thickness direction of an insulator layer, and a withdrawn-depth of the internal electrodes is about 1 μm or less when measured from the end surface. In a step of electroless plating, plating deposits formed at the end portions of the plurality of internal electrodes are increased in size so as to be connected to each other.