Laminated Electronic Component Manufacturing via Stick Bonding
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Solution Overview
Problem
Existing methods for manufacturing laminated electronic parts with ceramic laminates laminated in different directions face challenges in mass productivity and stability due to the need for precise positioning and sintering of individual laminates, leading to difficulties in achieving satisfactory electric characteristics and high yield rates.
Innovation Solution
A method involving the fabrication of stick-shaped laminate groups, which are then thermocompression bonded and sintered together, eliminating the need for individual laminate handling and reducing sintering-induced shape deformations, allowing for efficient integration of ceramic laminates with different lamination directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If individual laminates are sintered and adhered to fabricate electronic parts with different lamination directions, then the electronic part can achieve reduced size and improved functionality, but the manufacturing complexity and difficulty increase significantly
Solution Approach 1:
The patent divides the manufacturing process into two stages: first, multiple laminates are sintered individually into green bodies; second, these green bodies are adhered together in different orientations and then sintered again as a integrated structure. This segmentation allows each laminate to be processed independently while achieving complex multi-directional configurations in the final product.
Solution Approach 2:
The patent performs preliminary sintering of individual laminates into green bodies before final assembly. This preliminary action creates stable, handleable forms that can be precisely positioned and adhered in different directions, reducing manufacturing difficulty while maintaining design flexibility.
2Reliability
If individual laminates are precisely positioned and adhered to achieve different lamination directions, then circuit element interference is reduced, but productivity and yield rate decrease
Solution Approach 1:
The patent merges multiple individual laminate processing steps into a single integrated sintering process. After adhering green bodies in different orientations, the entire assembly is sintered together in one operation, eliminating the need for repeated positioning and sintering cycles and significantly improving productivity.
Solution Approach 2:
The green body adhesion structure is designed to maintain precise positioning automatically during the final sintering process. The structure self-stabilizes during manufacturing, reducing the need for complex external positioning mechanisms and improving both yield rate and productivity.
3Stability of the object's composition
If sintering is performed on individual laminates to achieve stable shape, then shape stability improves, but positioning accuracy between internal electrodes deteriorates
Solution Approach 1:
The patent performs preliminary sintering to create green bodies with stable shapes that are easy to handle and position. These pre-sintered green bodies serve as stable carriers that maintain their shape during assembly, while the final integrated sintering ensures precise electrode positioning across the entire multi-directional structure.
Solution Approach 2:
The green body acts as an intermediary between individual laminate processing and final integrated sintering. It provides a stable, handleable form factor that facilitates precise positioning and adhesion, while the subsequent integrated sintering process ensures accurate electrode alignment in the final product.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances operability and productivity while maintaining satisfactory electric characteristics by preventing mutual interference between circuit elements and reducing parasitic capacitance, thus enabling efficient manufacturing of laminated electronic parts with improved size reduction and functionality.
Implementation Method 1
creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate
Implementation Method 2
thermocompression bonding the first laminate sticks and second laminate sticks for integration
Data Source
AI summary
A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.