Laminated Vehicle Glass Ground Structure for ESD Shielding
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Solution Overview
Problem
Laminated glass with electrically driven functional layers is vulnerable to static electricity discharge, which can damage the sealed functional layer or semiconductor members, and existing static electricity protection devices are difficult to integrate during lamination.
Innovation Solution
A ground structure-equipped laminated glass design with a power supply member connected to the functional layer, a first circuit, an ESD shield, and a ground member connected in series, with a dielectric in the second circuit to ground the ESD shield, providing a robust static electricity protection mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a static electricity protection device is added to the laminated glass, then the functional layer and semiconductor members are protected from electrostatic discharge, but the device complexity and difficulty of mounting increase
Solution Approach 1:
The ground structure is merged with the existing interlayer assembly. The flexible ESD shield and ground member are integrated into the interlayer stack, combining the protection function with the bonding function of the interlayer, thereby avoiding additional separate mounting steps and reducing overall device complexity.
Solution Approach 2:
The interlayer assembly serves multiple functions: it bonds the glass plates together, provides electrical insulation, and now also provides electrostatic discharge protection through the integrated ground structure. This multi-functionality eliminates the need for separate protection devices and simplifies the overall structure.
2Reliability
If a static electricity protection device is added to the laminated glass, then the functional layer and semiconductor members are protected from electrostatic discharge, but the ease of manufacture during lamination process deteriorates
Solution Approach 1:
The flexible ESD shield and ground member are prepared and positioned in advance during the interlayer assembly preparation stage, before the actual lamination process. This preliminary action ensures that the protection structure is already in place and requires no special steps during the high-temperature lamination process itself.
Solution Approach 2:
The flexible ESD shield is designed with specific material properties (flexibility, thinness) that allow it to conform to the interlayer assembly and withstand the lamination process conditions. The material parameters are selected to ensure compatibility with the manufacturing process while maintaining protection functionality.
3Ease of operation
If the semiconductor member is electrically floating to simplify structure, then mounting is easier, but shielding/grounding as countermeasure against static electricity becomes structurally difficult
Solution Approach 1:
The flexible ESD shield acts as an intermediary between the semiconductor member and the ground member. It provides a controlled electrical connection path to ground while maintaining the simplicity of the overall structure. The shield mediates the electrical interaction, allowing grounding without complex wiring or structural modifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively shields static electricity from reaching the functional layer, protecting it and semiconductor members by grounding the discharge through a dedicated circuit with a dielectric to prevent damage.
Implementation Method 1
the second circuit having a dielectric at least at one point in the second circuit
Data Source
AI summary
A ground structure-equipped laminated glass for vehicles is provided, with a countermeasure against static electricity on an electrically driven functional layer. The ground structure-equipped laminated glass for vehicles comprises a first glass plate, an interlayer and a second glass plate laminated in this order, wherein the interlayer has an electrically driven functional layer, a power supply member electrically connected to the electrically driven functional layer, a first circuit having the power supply member and the functional layer connected in series, and a second circuit having the power supply member, a flexible ESD shield, and a ground member connected in series, wherein at least one of the power supply member, the flexible ESD shield, and the ground member comprises a dielectric, and the ground member is grounded.