Laminated Glass Pane Electronic Module with Gap Decoupling

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Solution Overview

Problem

Existing laminated glass panes with embedded electronic functional modules suffer from mechanical interference during the lamination process, leading to deterioration in performance and reliability, particularly when thin conductor structures are closely spaced.

Innovation Solution

Mechanically decouple the electronic functional module from the intermediate layer by creating a gap and using a thin carrier polymer film with a thickness of 30-70 µm to support the module, ensuring the module's thickness is equal to or less than the connecting polymer film, and surround it with a spiral conductor track.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the electronic functional module is integrated directly into the intermediate layer, then the device complexity is reduced and manufacturing is simplified, but the reliability deteriorates due to mechanical interference from polymer flow during lamination

Engineering Contradiction:
Improveintegration complexityVSAvoidmodule performance reliability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent divides the intermediate layer into two distinct parts: a first intermediate layer portion that bonds the first pane to the substrate, and a second intermediate layer portion that bonds the second pane to the substrate. The electronic functional module is positioned between these two portions, creating spatial separation from the bonding zones where polymer flow occurs. This segmentation allows the module to be isolated from mechanical interference while maintaining overall structural integration.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a protective layer as an intermediary element between the electronic functional module and the intermediate layer. This protective layer acts as a barrier that prevents direct mechanical contact between the flowing polymer and the module's conductor structures, thereby protecting the module's reliability without compromising the bonding function of the intermediate layer.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Adaptability or versatility

If the functional module thickness exceeds the connecting polymer film thickness, then the module's functional capabilities are enhanced, but the lamination process cannot proceed with standard polymer films

Engineering Contradiction:
Improvemodule functional capabilityVSAvoidlining process compatibility
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent resolves the thickness conflict by transitioning from a single-layer intermediate layer to a multi-layer intermediate layer structure. By stacking multiple intermediate layer portions with different functions, the system achieves greater total thickness to accommodate thicker functional modules while maintaining compatibility with standard lamination processes for each individual layer.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Volume of moving object

If thin conductor structures are placed closely around the functional element, then the device miniaturization is achieved, but the mechanical stability deteriorates due to sensitivity to polymer flow

Engineering Contradiction:
Improvemodule sizeVSAvoidconductor structure stability
Core Design Contradiction:
Volume of moving objectVSStability of the object's composition

Solution Approach 1:

The protective layer serves as a mediator that shields the thin, closely-spaced conductor structures from direct exposure to the flowing intermediate layer material. This allows the conductor structures to maintain their miniaturized geometry while the protective layer absorbs and distributes the mechanical stresses from polymer flow, preventing deformation of the sensitive conductors.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentEP4021719B1Laminated glass pane comprising an electronic functional module
Publication Date: 2025.09.17 SAINT GOBAIN SEKURIT FRANCE
  • EP4021719B1 patent drawingFigure 1a~1b
  • EP4021719B1 patent drawingFigure 2a~2b
  • EP4021719B1 patent drawingFigure 3

AI summary

The invention relates to a laminated glass pane (1) which has two glass or polymer panes (1a, 1b) and at least one connecting polymer film or connecting laminate (1c) adhesively bonded therebetween, wherein: a cut-out (1d) in the connecting polymer film or connecting laminate (1c) is provided in a part-area of the laminated glass pane (1), and an electronic functional module (2) is accommodated in the cut-out (1d), said electronic functional module having a thickness smaller than the thickness of the connecting polymer film or connecting laminate (1c); the functional module (2) has an electronic functional element (2c) which is fixed to a separate, thin carrier polymer film (2a) on one of the glass or polymer panes (1a, 1b); an antenna (2b) and/or conductor structure is printed onto the carrier polymer film (2a), said antenna and/or conductor structure having a spiral or polygonal-spiral conductor track which surrounds the functional element (2c).