Laminated Heat Sink with Variable Plate Thickness
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Solution Overview
Problem
Conventional laminated type heat sinks exhibit high temperature distribution and swirling currents near transverse ribs, leading to inefficient heat exchange due to detention regions and broad high-temperature areas on the downstream side.
Innovation Solution
A laminated core type heat sink with plates of varying thicknesses, where adjacent plates have identical thickness and a second plate is thicker than the first, with shifted transverse ribs and integral manifold and frame parts, enhancing refrigerant flow and heat exchange by optimizing the thickness ratio and lamination structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If plates of identical thickness are used in the laminated heat sink, then manufacturing is simplified, but temperature distribution becomes excessive and heat exchange efficiency deteriorates due to swirling currents and detention regions
Solution Approach 1:
The patent applies local quality by varying the thickness of specific plates (first plate thicker than second plate) at different positions in the lamination direction. This creates non-uniform local thickness to eliminate detention regions and improve refrigerant flow, while maintaining manufacturing feasibility through controlled thickness variation rather than complete non-uniformity
Solution Approach 2:
The patent changes the thickness parameter of plates in the lamination direction, specifically making the first plate thicker than the second plate. This parameter variation optimizes the flow path cross-sectional area to eliminate swirling currents and detention regions, thereby improving heat exchange efficiency
2Strength
If transverse ribs are arranged on all plates, then structural integrity is improved, but detention regions form on the downstream side causing high temperature distribution
Solution Approach 1:
The patent applies local quality by selectively arranging transverse ribs only on the second plate (thinner plate) while omitting them from the first plate (thicker plate). This local differentiation prevents detention regions from forming on the downstream side where they would cause high temperature distribution, while maintaining structural integrity through strategic rib placement
3Quantity of substance
If uniform plate thickness is maintained, then material cost is reduced, but flow state deteriorates with swirling currents and broad high-temperature regions
Solution Approach 1:
The patent applies local quality by using different plate thicknesses (first plate thicker than second plate) at specific locations in the lamination direction. This local thickness variation optimizes the flow path cross-sectional area to eliminate swirling currents and detention regions, improving refrigerant flow efficiency while controlling material usage through targeted thickness differentiation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves refrigerant flow and reduces high-temperature regions, accelerating heat exchange and reducing heat resistance, while maintaining cost-effectiveness by eliminating the need for separate thicker plates.
Implementation Method 1
a refrigerant is circulated into each of the slits (1) of the core in a longitudinal rib (2) direction, and an object (6) to be cooled is joined to an outer surface of the end lid (9)
Implementation Method 2
a refrigerant 7 circulates in a meandering shape escaping from each transverse rib 3 of adjacent plates
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
To further improve heat exchange performance in a laminated core type heat sink in which a plate is formed by arranging a plurality of slits in parallel to a metal flat plate and laminating the plate in large numbers. Thickness T2 of a second plate 4b positioned on the second in the lamination direction from an end lid 9 to which a semiconductor is attached is made greater than thickness T1 of a first plate 4a other than the second plate 4b.