Laminated Heater with Mixed Resistance Traces for Uniform Temperature
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Solution Overview
Problem
Substrate processing systems face challenges in achieving temperature uniformity and reducing heater exclusion zones due to structural limitations and heat output variations from different materials used in heating element and bus traces, which affect the design flexibility and performance of substrate supports like electrostatic chucks.
Innovation Solution
The use of different materials for heating element traces and bus traces, where the bus traces have a lower electrical resistance than the heating element traces, allows for improved temperature uniformity and design flexibility by minimizing heat output in overlapping areas, while maintaining the same physical dimensions and flatness, and eliminating the need for a conductor layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the same material is used for both heating element traces and bus traces, then manufacturing is simpler, but temperature uniformity deteriorates due to heat output variations in overlapping areas
Solution Approach 1:
The patent applies local quality by using different materials for different parts of the heating system: high resistance material (e.g., constantan) for heating element traces that require localized heat generation, and low resistance material (e.g., copper) for bus traces that require minimal heat output. This material differentiation resolves the contradiction by optimizing each zone's thermal characteristics while maintaining manufacturing feasibility through a laminated structure.
2Adaptability or versatility
If a conductor layer is added to route electrical connections, then design flexibility improves, but device complexity increases
Solution Approach 1:
The patent merges the conductor layer with the heating layer by forming electrical connections directly within the same laminated structure. The low resistance material traces serve dual purposes as both electrical connections and heating elements, eliminating the need for a separate conductor layer and reducing overall device complexity while maintaining design flexibility.
Solution Approach 2:
The heating layer is designed to perform multiple functions: it provides both heating capability through high resistance traces and electrical connectivity through low resistance bus traces. This multi-functionality eliminates the need for separate conductor layers, resolving the contradiction between design flexibility and structural complexity.
3Area of stationary object
If heating elements are placed closer to vias and wiring, then heater exclusion zones are reduced, but temperature uniformity worsens due to increased heat output from overlapping areas
Solution Approach 1:
The patent applies local quality by using different resistance materials in different spatial zones: high resistance material for heating elements in areas requiring temperature control, and low resistance material for bus traces in areas where minimal heat generation is desired. This allows heater placement closer to vias without compromising temperature uniformity, as the low resistance bus traces minimize unwanted heat output in overlapping regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances temperature uniformity across the substrate support, reduces heater exclusion zones, and maintains design flexibility by optimizing the placement of vias and wiring, thereby improving the overall performance of substrate processing systems.
Implementation Method 1
A heating layer may be arranged between the ceramic layer and a baseplate of the substrate support. For example only, the heating layer may be a ceramic heating plate including heating elements, wiring, etc. The temperature of the substrate maybe controlled during process steps by controlling the temperature of the heating plate.
Implementation Method 2
The first heating element is arranged in a second zone of the plurality of heating zones and the electrical connection includes a second material having a second electrical resistance that is less than the first electrical resistance. In other features, a heat output of the electrical connection is less than a heat output of the first heating element for a same voltage input.
Data Source
AI summary
A substrate support for a substrate processing system includes a plurality of heating zones, a baseplate, at least one of a heating layer and a ceramic layer arranged on the baseplate, and a plurality of heating elements provided within the at least one of the heating layer and the ceramic layer. The plurality of heating elements includes a first material having a first electrical resistance. Wiring is provided through the baseplate in a first zone of the plurality of heating zones. An electrical connection is routed from the wiring in the first zone to a first heating element of the plurality of heating elements. The first heating element is arranged in a second zone of the plurality of heating zones and the electrical connection includes a second material having a second electrical resistance that is less than the first electrical resistance.