Laminated HTS Wire Assembly with Extracted Ferromagnetic Substrate
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Solution Overview
Problem
High temperature superconducting (HTS) wires face challenges in achieving increased engineering current density and improved electrical performance, particularly in AC applications, due to the magnetic properties of certain substrates used, which affect their performance and require innovative manufacturing processes to enhance these characteristics.
Innovation Solution
A laminated superconductor wire assembly is developed, featuring high temperature superconductor layers with conductive cap layers and lamination layers, where the textured substrate is removed and reused, allowing for increased engineering current density and improved electrical performance by eliminating ferromagnetic substrates and optimizing the wire architecture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If ferromagnetic substrates (e.g., nickel tungsten) are used in HTS wires, then structural support is provided, but electrical performance in AC applications deteriorates due to magnetic properties
Solution Approach 1:
The patent extracts and removes the ferromagnetic substrate from the HTS wire structure, eliminating the source of magnetic interference. The substrate is separated from the superconductor layer, allowing the magnetic problematic material to be taken out while preserving the functional superconducting components.
Solution Approach 2:
The patent segments the HTS wire into distinct functional layers: the superconductor layer is separated from the substrate, with intermediate buffer layers and cap layers. This segmentation allows each layer to perform its specific function without the negative interactions that occur when ferromagnetic materials are present.
2Stability of the object's composition
If substrate thickness is increased to provide mechanical stability, then structural stability improves, but engineering current density decreases due to larger cross-sectional area
Solution Approach 1:
The patent employs thin film technology to create mechanically stable yet thin substrate and buffer layers. These thin films provide the necessary mechanical support and structural stability while minimizing the cross-sectional area occupied by non-superconducting materials, thereby maximizing the engineering current density.
Solution Approach 2:
The patent uses composite material structures with multiple functional layers including buffer layers, cap layers, and stabilizer layers. Each layer is optimized for its specific function, creating a composite structure that achieves mechanical stability without requiring excessive substrate thickness.
3Strength
If more magnetic material is used in substrates, then mechanical strength increases, but electrical performance in AC applications worsens
Solution Approach 1:
The patent extracts the ferromagnetic substrate material from the final wire structure, eliminating the harmful magnetic properties while maintaining mechanical strength through alternative support structures and layer configurations.
Solution Approach 2:
The patent changes the material parameters by selecting non-ferromagnetic or low-magnetic materials for the substrate and buffer layers, fundamentally altering the magnetic properties of the wire while maintaining or improving mechanical strength through optimized layer design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a significant increase in engineering current density and improved electrical performance in AC applications, as demonstrated by the doubling of critical current and reduction in substrate thickness, thereby overcoming the limitations of existing HTS wire technologies.
Implementation Method 1
high temperature superconductor layers with conductive cap layers... critical current densities, Jc, of 3 MA/cm2 or higher at 77 K
Data Source
AI summary
A superconductor wire having a first HTS layer with a first cap layer in direct contact with a first surface of the first HTS layer and a second cap layer in direct contact with a second surface of the first HTS layer. There is a first lamination layer affixed to the first cap layer and a stabilizer layer having a first surface affixed to the second cap layer. There is a second HTS layer and a third cap layer in direct contact with a first surface of the second HTS layer and a fourth cap layer in direct contact with a second surface of the second HTS layer. There is a second lamination layer affixed to the fourth cap layer. The second surface of the stabilizer layer is affixed to the third cap layer and there are first and second fillets disposed along a edge of the laminated superconductor.