Laminated Liquid Ejecting Head Flow Channel Design

The patent transitions from planar flow channel arrangement to a three-dimensional laminated structure. Multiple flow channel substrates are stacked in the thickness direction, with distribution flow channels formed on different planes. This dimensional change allows flow channels to be arranged vertically rather than horizontally, reducing the planar footprint and simplifying the overall arrangement while maintaining effective liquid distribution to all head chips.

By stacking flow channel substrates in the thickness direction, the patent utilizes the vertical dimension to accommodate multiple distribution flow channels. This eliminates the need for extensive planar expansion, as channels that would otherwise require significant horizontal space are now arranged in vertical layers, significantly reducing the overall area occupied by flow channel members.

The patent designs the distribution flow channels across different laminated substrates to have equivalent flow paths and characteristics. By carefully configuring the channel geometry, length, and cross-sectional area on each substrate layer, the invention ensures that liquid experiences similar pressure losses regardless of which distribution channel it flows through. This equipotential design enables balanced liquid supply to multiple head chips while minimizing pressure loss variation.