Laminated Magnetic Core Structure for Compact Low-Loss Power Modules
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Solution Overview
Problem
Conventional power conversion modules face challenges in reducing the volume and core loss of magnetic devices, leading to increased thermal resistance and inductor saturation, which affects power conversion efficiency.
Innovation Solution
A magnetic device is designed with laminated conductive structures and a powder magnetic material, eliminating the need for a printed circuit board, and incorporating electroplating structures to enhance signal transfer and reduce core loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an E-shaped core is embedded within a printed circuit board main frame, then the magnetic device can be formed, but the height tolerance accumulates leading to large overall height tolerance and small effective volume
Solution Approach 1:
The patent merges the E-shaped core and the printed circuit board into a single integrated structure, eliminating the separate embedding process. The core is formed with recesses that directly receive the circuit board, eliminating accumulated height tolerances and maximizing effective volume within the overall footprint.
2Loss of energy
If the magnetic device volume is reduced, then the power conversion efficiency increases, but the core loss and conducting loss increase leading to inductor saturation
Solution Approach 1:
The patent applies local quality by creating recesses in specific locations of the E-shaped core to receive conductive structures. This localized modification optimizes the magnetic path and reduces core loss in critical areas without requiring a complete redesign of the entire magnetic device, thereby reducing volume while controlling losses.
Solution Approach 2:
The patent uses composite construction by integrating conductive structures (copper or aluminum) directly into recesses of the magnetic core, forming a composite magnetic-electrical structure. This reduces the need for separate winding assemblies and allows for optimized loss characteristics in a compact volume.
3Loss of energy
If the magnetic device volume is reduced, then the power conversion efficiency increases, but thermal resistance increases
Solution Approach 1:
The patent merges the magnetic core and conductive structures into an integrated assembly with direct thermal contact. The conductive structures are positioned within recesses of the core, creating efficient thermal pathways that conduct heat away from loss-generating areas, thereby reducing thermal resistance while maintaining compact volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces the volume and core loss of the magnetic device, enhancing power conversion efficiency and dynamic response while minimizing thermal resistance.
Implementation Method 1
The first electroplating structure and the second electroplating structure are used for signal transfer
Implementation Method 2
a magnetic core formed of a powder magnetic material
Data Source
AI summary
A magnetic device includes a first conductive structure, a second conductive structure and a magnetic core formed of a powder magnetic material. The first conductive structure includes a first connection part, a first conductive body and a second connection part. The first conductive body is connected between the first connection part and the second connection part. The second conductive structure includes a third connection part, a second conductive body and a fourth connection part. The powder magnetic material, the first conductive structure and the second conductive structure are laminated together. The first conductive structure and the second conductive structure are embedded in the magnetic core. The first connection part and the third connection part are exposed to the fifth surface. The second connection part and the fourth connection part are exposed to the sixth surface.