Laminated Microchannel Devices with Deforming Fin Inserts
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Solution Overview
Problem
Conventional microchannel heat exchangers rely on diffusion bonding and brazing for optimal heat transfer, which require interlayer materials and complex processes, limiting their efficiency and scalability.
Innovation Solution
A method involving a laminated device with a thermally conductive fin insert that deforms to fit within a gap between sheets, providing irregular compression and enhancing thermal contact without the need for diffusion bonding or brazing, using a press-fit mechanism and welding to secure the layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If diffusion bonding or brazing is used to join layers in microchannel heat exchangers, then thermal contact resistance between layers is eliminated, but manufacturing complexity and cost increase due to required interlayer materials and complex processes
Solution Approach 1:
The patent removes the interlayer material requirement from the joining process. Instead of using diffusion bonding or brazing that require intermediate materials, the invention directly bonds the heat transfer layer to the structural layer through welding, eliminating the complex interlayer material selection and application steps while maintaining thermal contact performance
Solution Approach 2:
The patent replaces the thermal-field-based joining processes (diffusion bonding and brazing that rely on heat and material diffusion) with a mechanical-thermal process (welding). This substitution eliminates the need for interlayer materials and their associated complex processes, achieving both structural integrity and thermal contact through the welding mechanism
2Reliability
If diffusion bonding or brazing is used to join layers, then optimal heat transfer is achieved, but manufacturing time and energy consumption increase due to high temperature processing and complex procedures
Solution Approach 1:
The patent replaces the time-consuming thermal diffusion processes (bonding and brazing that require prolonged high-temperature exposure for material diffusion) with welding, which achieves both structural bonding and thermal contact in a single, faster operation, significantly reducing manufacturing cycle time and energy consumption
Solution Approach 2:
The patent combines the structural joining function and the thermal contact function into a single welding operation. Instead of separately achieving structural integrity through bonding/brazing and thermal contact through interlayer materials, the welding process simultaneously accomplishes both objectives, reducing total process time
3Strength
If interlayer materials are used for brazing, then layers are joined together, but manufacturing cost increases due to additional material requirements and process steps
Solution Approach 1:
The patent extracts and eliminates the interlayer material from the joining system. By using welding to directly bond the heat transfer layer to the structural layer, the invention removes the need for additional brazing materials, reducing material costs and simplifying the manufacturing process while maintaining strong layer bonding
Solution Approach 2:
The patent makes the welding process multi-functional, serving both as the structural joining method and as the thermal contact establishment method. This universal approach eliminates the need for specialized interlayer materials that would otherwise be required to achieve both bonding strength and thermal contact, simplifying manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables effective thermal transport and heat exchange in microchannel devices, reducing manufacturing complexity and costs while maintaining performance, even in large-scale applications.
Implementation Method 1
providing a thermally conductive fin insert having a height that is at least 1% greater than the gap height, placing the fin insert in the gap
Implementation Method 2
pressing the sheets together such that the fin insert deforms to fit within the gap
Implementation Method 3
the fin insert deforms to fit within the gap
Implementation Method 4
using a press-fit mechanism and welding to secure the layers
Data Source
AI summary
The invention provides methods of making laminated devices (especially microchannel devices) in which plates are assembled and welded together. Unlike conventional microchannel devices, the inventive laminated devices can be made without brazing or diffusion bonding; thus providing significant advantages for manufacturing. Features such as expansion joints and external welded supports are also described. Laminated devices and methods of conducting unit operations in laminated devices are also described.