Vertically Laminated Microdisplay Panel Without Color Filters
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Solution Overview
Problem
Conventional microdisplay panels face challenges in mass-producing high-pixel density LEDOS microdisplays due to difficulties in ultra-fine arrangement of ultra-small micro-LEDs, high manufacturing costs, and the need for a color filter, which affects color quality and process complexity.
Innovation Solution
A vertically-laminated microdisplay panel design that eliminates the need for a color filter by using a back wafer with CMOS electrode pads and vertically stacked LED stacks emitting specific colors, employing ceramic materials for bonding and etching to improve yield and resolution, and using transparent electrodes to avoid arrangement errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional microdisplay panel manufacturing processes are used, then mass production of high-pixel density LEDOS microdisplays is attempted, but manufacturing complexity and costs increase due to difficulties in ultra-fine arrangement of ultra-small micro-LEDs
Solution Approach 1:
The patent transitions from planar arrangement of micro-LEDs to vertical stacking of multiple LED layers (red, green, blue) along the z-axis. This dimensional change allows high pixel density to be achieved through vertical integration rather than horizontal miniaturization, dramatically simplifying the manufacturing process while maintaining ultra-fine pixel dimensions.
Solution Approach 2:
The patent combines multiple color-emitting LED layers (red, green, blue) into a single vertical stack at each pixel location. This merging of multiple functional layers into one integrated structure eliminates the need for separate arrangement processes for each color, reducing manufacturing complexity while achieving high pixel density.
2Manufacturing precision
If conventional microdisplay panel manufacturing processes are used, then high-pixel density LEDOS microdisplays are produced, but manufacturing costs increase due to difficulties in ultra-fine arrangement
Solution Approach 1:
By moving to vertical stacking, the patent enables standard wafer fabrication techniques to be used instead of complex ultra-fine placement processes. This dimensional transition significantly reduces manufacturing costs while maintaining high pixel density, as vertical integration can be achieved through conventional semiconductor processing.
Solution Approach 2:
The vertical LED stack structure serves multiple functions simultaneously: it provides red, green, and blue emission from a single pixel location while using standard wafer processing techniques. This multi-functionality approach eliminates the need for specialized ultra-fine arrangement equipment and processes, thereby reducing manufacturing costs.
3Illumination intensity
If a color filter is used in conventional microdisplay panels, then color quality is affected and process complexity increases
Solution Approach 1:
The patent extracts and eliminates the color filter component from the display structure by using inherently color-emitting LED materials for each layer. Instead of generating white light and filtering it, the design directly emits red, green, and blue light from separate LED layers, removing the color filter and associated complex processes while improving color quality.
4Productivity
If larger wafers are used for manufacturing, then yield and ease of manufacturing improve, but conventional processes cannot achieve high pixel density
Solution Approach 1:
The vertical stacking approach allows standard-sized wafers to produce high pixel density displays by utilizing the third dimension. Each wafer can be processed using conventional techniques, and the vertical integration of multiple LED layers achieves ultra-fine pixel density without requiring oversized wafers or specialized ultra-fine processing equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances color quality, productivity, and reduces electrical short circuits, enabling the use of larger wafers for higher yield and ease of manufacturing ultra-fine pixels, thus lowering costs and improving device reliability.
Implementation Method 1
each LED stack emits only light of a specific color by blocking light generated from at least one light-emitting portion of the plurality of light-emitting portions or forming a short path in at least one light-emitting portion of the plurality of light-emitting portions so that a current does not flow into and bypasses the light-emitting portion
Data Source
AI summary
The present invention relates to a vertically-laminated microdisplay panel requiring no color filter, the panel comprising: a back wafer, the top surface of which has multiple CMOS electrode pads aligned thereon; multiple LED laminates, each of which includes multiple light emitting units and multiple bonding layers vertically laminated on the back wafer, and which are aligned on the multiple CMOS electrode pads, respectively; and a common electrode formed on the multiple LED laminates, wherein each of the multiple LED laminates emits only a particular color by blocking the light generated from at least one light emitting unit among the multiple light emitting units, or having a short passage formed through at least one light emitting unit among the multiple light emitting units to bypass current so as to prevent the current from being injected into the light emitting unit.