Laminated Semiconductor Package Warpage Correction for Sensor Accuracy

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Solution Overview

Problem

Conventional semiconductor packages with laminated chips experience warpage due to heat generation, which affects the measurement accuracy of sensors like gyroscopes.

Innovation Solution

Incorporating a laminated chip that measures temperature and estimates warpage, and a measurement unit that corrects measurement information based on temperature and warpage, along with features such as a cavity, ground patterns, dummy silicon, and a metal plate to reduce warpage and improve sensor accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If multiple chips are laminated to save area, then area utilization is improved, but warpage occurs due to heat generation

Engineering Contradiction:

Improvearea utilizationVSAvoidwarpage

Core Design Contradiction:

Area of stationary objectVSShape

Solution Approach 1:

The patent applies preliminary action by estimating warpage before it significantly affects sensor measurements. The warpage estimation unit calculates warpage based on temperature distribution data from multiple temperature sensors, enabling corrective actions to be taken in advance to maintain measurement accuracy.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent implements feedback through a closed-loop system where temperature sensors continuously monitor temperature distribution, the warpage estimation unit calculates warpage based on this data, and the measurement correction unit uses the estimated warpage to correct sensor measurements. This feedback mechanism dynamically compensates for warpage effects.

Inventive Principle:

Principle #23Feedback

2Measurement precision

If warpage correction is implemented to improve measurement accuracy, then measurement precision is improved, but device complexity increases

Engineering Contradiction:

Improvemeasurement accuracyVSAvoiddevice complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The patent introduces an intermediary approach by using temperature distribution as a mediator to estimate warpage. Instead of directly measuring warpage (which would require complex displacement sensors), the system uses temperature data from existing temperature sensors to infer warpage conditions and apply corrections accordingly.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces mechanical warpage measurement systems with a thermal-based estimation system. By substituting direct mechanical displacement measurement with temperature-based warpage estimation, the system achieves warpage correction without requiring additional mechanical sensors or complex mechanical structures.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Measurement precision

If temperature measurement is used to estimate warpage, then warpage estimation accuracy is improved, but heat concentration affects sensor performance

Engineering Contradiction:

Improvewarpage estimation accuracyVSAvoidheat concentration

Core Design Contradiction:

Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The patent applies segmentation by dividing the temperature measurement function into multiple temperature sensors distributed at different locations on the substrate. This segmentation allows the system to capture temperature distribution patterns and distinguish between general heat concentration and localized thermal gradients that cause warpage.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent implements local quality by placing temperature sensors at specific locations where they can best detect temperature gradients related to warpage. The system focuses on local temperature differences rather than overall temperature, enabling accurate warpage estimation while minimizing the impact of general heat concentration on sensor performance.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances the measurement accuracy of sensors by correcting for warpage and temperature-induced errors, allowing for improved image data capture and inertial information processing.

Implementation Method 1

the first substrate or the circuit substrate generates heat during the operation of the circuit and warpage is caused in such a substrate

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

a measurement unit that performs processing of measuring a predetermined physical quantity and generating measurement information and processing of correcting the measurement information on the basis of the degree of warpage

Methodology Applied

Scientific EffectThermal distortion correction: Thermal Expansion

Data Source

PatentUS20250251238A1Semiconductor package and module

Publication Date: 2025.08.07 SONY SEMICON SOLUTIONS CORP

AI summary

To improve the measurement accuracy of a sensor in a semiconductor package provided with the sensor. A semiconductor package includes a laminated chip and a measurement unit. In the semiconductor package including the laminated chip and the measurement unit, the laminated chip measures a temperature and estimates a degree of warpage of the laminated chip on the basis of the temperature. Moreover, in the semiconductor package, the measurement unit performs processing of measuring a predetermined physical quantity and generating measurement information and processing of correcting the measurement information on the basis of the degree of warpage.