Laminated Packaging Material with Through-Hole Adhesive Containment

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing methods for manufacturing laminated packaging materials with pre-punched holes for liquid food containers face inefficiencies and flexibility issues, as they require process interruptions to adjust lamination equipment when holes are present, leading to adhesive leakage and equipment contamination.

Innovation Solution

A method involving a controlled positioning of a non-adhesive lamination means over the through hole during the lamination process, ensuring the adhesive is contained, using a non-adhesive lamination means between the bulk and substrate layers, allowing continuous operation without equipment contamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a through hole is present in the bulk layer during lamination, then access to liquid food product is enabled, but adhesive material spreads in an uncontrolled manner via the hole

Engineering Contradiction:
Improveaccess to liquid food productVSAvoidadhesive material spreading
Core Design Contradiction:
Ease of operationVSObject-generated harmful factors

Solution Approach 1:

A reception means is introduced as an intermediary element between the bulk layer and the lamination means. This reception means temporarily receives and contains the adhesive material that would otherwise spread uncontrolled through the through hole, thereby mediating between the hole's presence and the lamination process

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The harmful function of the through hole (uncontrolled adhesive spread) is extracted and isolated by providing a dedicated reception means that specifically addresses this issue, separating the hole's beneficial function (access) from its harmful function (adhesive leakage)

Inventive Principle:
Principle #2Taking out (Extraction)

2Strength

If lamination pressure is applied to join bulk layer and substrate layer, then bonding is achieved, but adhesive material is squeezed through the hole to the opposite side

Engineering Contradiction:
Improvebonding strengthVSAvoidadhesive material leakage
Core Design Contradiction:
StrengthVSObject-generated harmful factors

Solution Approach 1:

The reception means acts as a mediator that intercepts adhesive material during the lamination pressure application, allowing the bonding process to proceed while preventing the harmful squeezing of adhesive through the hole to the opposite side

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The reception means is positioned in advance to counteract the potential harmful effect of adhesive squeezing before it occurs, providing preliminary protection against adhesive leakage during the lamination process

Inventive Principle:
Principle #9Preliminary anti-action

3Productivity

If conventional lamination equipment is used with through holes, then manufacturing can proceed, but equipment contamination and process interruptions occur

Engineering Contradiction:
Improvemanufacturing continuityVSAvoidequipment contamination
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The reception means serves as a protective intermediary between the lamination equipment and the adhesive material, preventing direct contact and contamination of the equipment while maintaining continuous manufacturing operations

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The presence of the through hole, which initially causes harmful adhesive leakage, is converted into a manageable condition by the reception means that specifically addresses this issue, allowing the manufacturing process to continue without interruptions

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Ensures safe and efficient lamination of packaging materials with through holes, preventing adhesive leakage and maintaining process continuity, thereby enhancing productivity and quality.

Implementation Method 1

at least one non-adhesive lamination means is kinematically arranged between the second lamination means and the bulk layer, wherein a position of the bulk layer and/or a position of said at least one non-adhesive lamination means is controlled so that the at least one through hole is covered by the at least one non-adhesive lamination means

Methodology Applied
Scientific EffectPhysical containment: Physical Containment

Implementation Method 2

a lamination pressure is created between the first and second lamination means, and wherein at least one non-adhesive lamination means is kinematically arranged between the second lamination means and the bulk layer

Methodology Applied
Scientific EffectPressure application: Pressure Increase

Data Source

PatentEP4467340B1Method of manufacturing a laminated packaging material and device for the method
Publication Date: 2026.04.01 TETRA LAVAL HOLDINGS & FINANCE SA
  • EP4467340B1 patent drawingFigure 1
  • EP4467340B1 patent drawingFigure 2
  • EP4467340B1 patent drawingFigure 3

AI summary

The present disclosure refers to a method of manufacturing a laminated packaging material (16), from which a packaging container (10) for packaging of liquid food products (12) can be formed, the method comprising the following steps: Providing a bulk layer (22) of paper or paperboard or other cellulose-based material with at least one through hole (24); Providing a substrate layer (26) and an adhesive (30) formed by or applied to a lamination side (28) thereof; Positioning the bulk layer (22) and the substrate layer (26) so that the adhesive (30) is facing a lamination side (32) of the bulk layer (22) and with said substrate layer (26) being arranged in front of the at least one through hole (24); and Joining the bulk layer (22) and the substrate layer (26) in a lamination unit (38), wherein a first lamination means (42), the substrate layer (26), the bulk layer (22) and a second lamination means (44) are kinematically arranged in the enumerate sequence and a lamination pressure (48) is created between the first and second lamination means (42; 44), and wherein at least one non-adhesive lamination means (46) is kinematically arranged between the second lamination means (44) and the bulk layer (22). A position of the bulk layer (22) and/or a position (50) of said at least one non-adhesive lamination means (46) is controlled so that the at least one through hole (24) is covered by the at least one non-adhesive lamination means (46), at least as long as the lamination pressure (48) is imposed on the at least one trough hole (24). The non-adhesive lamination means (46) is cleaned by a cleaning device (74) before and/or after having contacted the through hole (24). The present disclosure further refers to a respective device (36) to execute the method.