Laminated Pad Structures With Protective Patterns for Probe Cards
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Solution Overview
Problem
Probe cards used for electrical testing of IC chips face challenges in reliability due to reduced dimensions and pitches, requiring improved pad designs for better probing endurance and oxidation resistance.
Innovation Solution
A laminated structure is developed with protective patterns formed on core pads, comprising a reinforcement layer with increased hardness to enhance oxidation and moisture resistance, and a redistribution structure with conductive layers and dielectric layers for improved electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional pad designs are used for probe cards, then manufacturing is simpler, but probing endurance and oxidation resistance deteriorate
Solution Approach 1:
The pad structure is segmented into multiple functional layers: a core pad layer for electrical connection, a protective pattern layer for oxidation resistance, and a reinforcement layer for mechanical strength. This segmentation allows each layer to specialize in one function, improving overall reliability without overwhelming complexity.
Solution Approach 2:
The pad structure uses composite material design with different layers made from materials optimized for specific properties: conductive materials for electrical connection, oxidation-resistant materials for protection, and high-strength materials for reinforcement. This composite approach enhances probing endurance while maintaining manufacturability.
2Reliability
If conventional pad designs are used for probe cards, then manufacturing is simpler, but oxidation resistance deteriorates
Solution Approach 1:
A protective pattern layer is introduced as an intermediary between the core pad and the environment. This intermediate layer specifically addresses oxidation resistance by providing a barrier against oxidizing agents, while the rest of the structure maintains conventional simplicity for easy manufacturing.
3Productivity
If dimensions and pitches are reduced for advanced testing, then testing capability improves, but pad reliability deteriorates
Solution Approach 1:
The reinforcement is applied locally only to the pad regions that require enhanced durability, rather than strengthening the entire probe card structure. This localized quality enhancement maintains testing capability with reduced dimensions while improving pad reliability where it is most needed.
Data Source
AI summary
A laminated structure and the manufacturing methods thereof are provided. The structure includes an interconnect substrate having a first surface and a second surface opposite to the first surface, an insulating encapsulant laterally wrapping the interconnect substrate, and a redistribution structure disposed on the first surface of the interconnect substrate and electrically connected with the interconnect substrate. The redistribution structure has a third surface facing the first surface and a fourth surface opposite to the third surface. The redistribution structure includes first pads, second pads located beside the first pads, and protective patterns disposed on the first pads and covering the first pads. The first pads include pad portions protruded from the fourth surface and the protective patterns are in contact with sidewalls and top surfaces of the pad portions of the first pads.