Laminated Potted PCB Structure for IP67 Solar Module Electronics
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Solution Overview
Problem
Existing photovoltaic modules with module-level power electronics (MLPE) devices face challenges in achieving ingress protection and preventing water and moisture ingress, which can compromise the functionality and longevity of the printed circuit boards.
Innovation Solution
A laminated potted printed circuit board design is implemented, where a pottant covers the printed circuit board and is encapsulated with a polymer to create a substantially void-free structure, achieving an IP67 ingress protection rating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a potted printed circuit board design is used to prevent water and moisture ingress, then ingress protection is improved, but manufacturing complexity increases due to the lamination process
Solution Approach 1:
The patent combines the pottant material and the encapsulant into a single laminated structure. The pottant is applied to the printed circuit board first, then the encapsulant is laminated over it in a separate process. This merging of protective functions into a unified laminated structure achieves IP67 ingress protection while maintaining manufacturability through standardized lamination processes.
Solution Approach 2:
The pottant is applied to the printed circuit board before the encapsulant is installed. This preliminary action of potting the circuit board creates a first layer of protection that seals critical components and traces, establishing a foundation for the subsequent encapsulant application and ensuring complete protection before final assembly.
2Object-affected harmful factors
If a pottant covers the printed circuit board to prevent water ingress, then protection against harmful factors is improved, but the structural complexity increases
Solution Approach 1:
The pottant material forms a flexible protective coating over the printed circuit board. This flexible shell conformally covers the board's surface, sealing around components and traces while accommodating thermal expansion and contraction. The thin film nature of the pottant provides effective protection against water and moisture ingress without adding significant structural complexity or rigidity to the assembly.
Data Source
AI summary
Some embodiments of the present disclosure relate to a system. In some embodiments, the system includes a photovoltaic module and a module-level power electronics device electrically connected to the photovoltaic module. In some embodiments, the module-level power electronics device comprises a laminated potted printed circuit board. In some embodiments, the laminated potted printed circuit board comprises a potted printed circuit board and an encapsulant covering the potted printed circuit board. In some embodiments, the potted printed circuit board comprises: a printed circuit board having a top surface, and a pottant covering the top surface of the printed circuit board. In some embodiments, the laminated potted printed circuit board is substantially void-free.