Semiconductor device, semiconductor system, moving body, and method for manufacturing semiconductor device
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Solution Overview
Problem
The existing semiconductor devices in power modules of moving bodies, such as electric vehicles and trains, face issues with electrical short-circuits between semiconductor elements and coolers due to insulator deterioration, leading to ground faults and heat transfer inefficiencies.
Innovation Solution
A semiconductor device design featuring a laminated body with alternating conductor and insulator layers, which electrically insulates the semiconductor element from the cooler, allowing for efficient heat transfer while preventing short-circuits, even when the insulator margin is reduced.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thickness of the insulator is increased to ensure sufficient insulating property margin, then the reliability of electrical insulation is improved, but the thermal resistance increases and heat radiation efficiency deteriorates
Solution Approach 1:
The single insulator layer is segmented into multiple insulator layers (first insulator layer, second insulator layer, third insulator layer) separated by conductor layers. This segmentation allows the total insulating thickness to be maintained for reliability while reducing the thermal resistance path within each individual insulator layer, improving heat radiation efficiency.
2Temperature
If the thickness of the insulator is decreased to improve heat radiation efficiency, then the thermal resistance decreases and heat transfer improves, but the insulating property margin becomes insufficient and electrical short-circuit risk increases
Solution Approach 1:
The insulation structure transitions from a single-dimensional thick insulator to a multi-layered structure with conductor layers interspersed. This dimensional change creates multiple insulation paths while maintaining overall insulating property, allowing thinner individual insulator layers that improve heat radiation efficiency without sacrificing reliability.
3Device complexity
If a single thick insulator layer is used to ensure insulation reliability, then the device complexity is low, but the thermal resistance is high and heat transfer efficiency deteriorates
Solution Approach 1:
The insulator is segmented into multiple layers with conductor layers in between, creating a laminated structure. While this increases structural complexity compared to a single layer, it significantly improves heat transfer efficiency by reducing thermal resistance through the multiple conduction paths provided by the conductor layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses electrical short-circuits between semiconductor elements and coolers, allowing for reduced insulator thickness and lower thermal resistance, thereby enhancing heat emission efficiency and preventing semiconductor failures.
Implementation Method 1
The first insulator layer is arranged between the first conductor layer and the second conductor layer, and electrically insulates the first conductor layer from the second conductor layer. The second insulator layer is arranged between the second conductor layer and the third conductor layer, and electrically insulates the third conductor layer from the second conductor layer.
Implementation Method 2
The insulator transfers the heat emitted by the semiconductor element to the cooler... the thermal conductivity of the insulator... the thickness of the insulator is made larger so that the insulator has a dielectric strength of 6000V or higher... the thermal resistance of the insulator becomes large. When the thermal resistance of the insulator becomes large, sufficient transfer of the heat emitted from the semiconductor element to the cooler becomes difficult
Data Source
AI summary
A semiconductor device includes a laminated body, a semiconductor element, and a cooler. The laminated body includes a first conductor layer, a first insulator layer, a second conductor layer, a second insulator layer, and a third conductor layer. The first conductor layer, the first insulator layer, the second conductor layer, the second insulator layer and the third conductor layer are laminated. The first insulator layer is arranged between the first conductor layer and the second conductor layer, and electrically insulates the first conductor layer from the second conductor layer. The second insulator layer is arranged between the second conductor layer and the third conductor layer, and electrically insulates the third conductor layer from the second conductor layer. The semiconductor element is mounted on the first conductor layer. The cooler is connected to the third conductor layer.