Laminated Probe Card Pad Structure With Protective Patterns
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Solution Overview
Problem
Probe card pads in semiconductor testing face challenges with reduced dimensions and pitches, requiring improved probing endurance and resistance to oxidation and moisture, which affect the reliability of electrical connections.
Innovation Solution
A laminated structure is developed with protective patterns formed on probe card pads, comprising a reinforcement layer with increased hardness, covering the sidewalls and top surfaces of the pads to enhance protection and conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If probe card pads are reduced in dimension and pitch to increase testing capacity, then productivity improves, but reliability deteriorates due to reduced probing endurance and increased susceptibility to oxidation and moisture
Solution Approach 1:
The patent applies composite materials by forming a protective pattern comprising multiple layers (first protective layer and second protective layer) over the pad structure. The first protective layer provides oxidation resistance while the second protective layer provides moisture resistance, creating a composite protective system that maintains reliability despite reduced pad dimensions and pitch for higher testing capacity.
2Area of stationary object
If pad dimensions are reduced to increase density, then area utilization improves, but resistance to oxidation and moisture worsens
Solution Approach 1:
The patent applies local quality by providing different protective layers at different locations on the pad structure. The first protective layer is applied to surfaces exposed to oxidation, while the second protective layer is applied to surfaces exposed to moisture, creating location-specific protection that addresses different harmful factors at different parts of the reduced-dimension pad.
Solution Approach 2:
The patent uses composite materials by combining multiple protective layers with different functional properties. The first protective layer (e.g., nickel or palladium) provides oxidation resistance, while the second protective layer (e.g., polyimide or epoxy resin) provides moisture resistance, creating a composite protective system that compensates for the reduced pad area's increased vulnerability.
3Reliability
If protective layers are added to pads, then reliability improves through enhanced protection, but device complexity increases
Solution Approach 1:
The patent applies merging by combining the protective function with the existing pad structure fabrication process. The protective layers are formed as part of the redistribution structure fabrication sequence, integrating protection into the manufacturing flow rather than adding separate post-processing steps, thereby minimizing the increase in device complexity while achieving enhanced reliability.
Data Source
AI summary
A laminated structure and the manufacturing methods thereof are provided. The structure includes an interconnect substrate having a first surface and a second surface opposite to the first surface, an insulating encapsulant laterally wrapping the interconnect substrate, and a redistribution structure disposed on the first surface of the interconnect substrate and electrically connected with the interconnect substrate. The redistribution structure has a third surface facing the first surface and a fourth surface opposite to the third surface. The redistribution structure includes first pads, second pads located beside the first pads, and protective patterns disposed on the first pads and covering the first pads. The first pads include pad portions protruded from the fourth surface and the protective patterns are in contact with sidewalls and top surfaces of the pad portions of the first pads.