Laminated RF Interface Board for Compact Impedance-Matched Connections

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Solution Overview

Problem

Existing connectors for connecting conductive elements within laminated structures are bulky, require customized designs, and complicate impedance matching, especially in antenna applications, due to parasitic capacitive and inductive loadings.

Innovation Solution

An RF interface board with parallel, flat, and electrically isolated RF transmission strips on a dielectric support, allowing connection to different conductive elements within a laminated assembly, and integrated impedance tuning components, enabling use of commercially available connectors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If traditional connectors are used to connect conductive elements within laminated structures, then electrical connection is achieved, but the connector size and volume increase, making it impossible to use inside laminated structures

Engineering Contradiction:

Improveconnector volumeVSAvoidelectrical connection reliability

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The patent uses a flat and flexible connector comprising a flexible circuit board with transmission lines that can be laminated between dielectric panels. This thin-film approach replaces bulky traditional connectors, enabling integration within laminated structures while maintaining electrical connection functionality.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The flexible connector is embedded within the laminated structure by placing it between dielectric panels and bonding with adhesive layers. This nesting approach integrates the connector inside the laminated assembly rather than attaching it externally, reducing overall volume while preserving connection reliability.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Device complexity

If a flat and flexible connector is used to connect inside a laminated structure, then connection is achieved, but each conductive element on different surfaces requires its own separate interface

Engineering Contradiction:

Improvenumber of connectorsVSAvoidimpedance matching

Core Design Contradiction:

Device complexityVSEase of operation

Solution Approach 1:

The flexible circuit board is designed with multiple transmission lines that can simultaneously connect to multiple conductive elements on different surfaces. This multi-functional design allows a single connector to serve multiple connection purposes, reducing the total number of connectors needed while maintaining proper impedance characteristics.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent utilizes the third dimension by routing transmission lines through multiple layers of the flexible circuit board. This layered approach enables connection to conductive elements on different surfaces without requiring separate planar interfaces, as connections are established through vertical stacking and via holes in the flexible board.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If multiple customized connectors are used to feed conductive elements inside a laminated structure, then all conductive elements can be connected, but impedance matching becomes challenging due to parasitic capacitive and inductive loadings

Engineering Contradiction:

Improveconnection flexibilityVSAvoidimpedance matching precision

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent controls impedance by carefully designing the transmission line geometry, width, and spacing on the flexible circuit board. By adjusting these physical parameters during design, the connector achieves proper impedance matching (typically 50 ohms) while minimizing parasitic effects, eliminating the need for complex customized connectors.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses standard, commercially available flexible circuit boards with controlled impedance transmission lines rather than expensive customized connectors. This approach achieves adequate impedance matching through standard design practices, reducing manufacturing complexity and cost while maintaining connection versatility.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Data Source

PatentUS12356539B2Laminated assembly comprising radio-frequency interface board

Publication Date: 2025.07.08 AGC GLASS EUROPE SA

AI summary

An improved RF interface board and a laminated assembly having a RF interface board having an inner and an outer part. The laminated assembly includes a dielectric support having a first and a second surfaces and at least a first and a second RF transmission strips disposed on the dielectric support. The first and the second RF transmission strips are electrically isolated from each other, are configured to be connected to a connector at the outer part, and are each configured to be connected to a different conductive element at the inner part. The first RF transmission strip is on the first surface of the dielectric support.