Laminated RF Filter Module for Millimeter Wave Signal Loss Reduction
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Solution Overview
Problem
Current radio frequency filter modules face challenges in efficiently supporting high-frequency millimeter wave communications, such as 5G, due to increased data traffic and the need for effective filtering of multiple frequency bands, which results in signal loss and electromagnetic noise interference.
Innovation Solution
A radio frequency filter module with a laminated structure that includes patch antennas, an integrated circuit package, and a connecting member with multiple filter layers and ground layers, featuring distinct radio frequency filter patterns and extension patterns to reduce electrical length and enhance gain, directivity, and electromagnetic isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple filter layers are added to support multiple frequency bands, then frequency band coverage is improved, but signal loss increases
Solution Approach 1:
The patent implements nested filter structures where second and third filters are positioned within the spatial envelope of the first filter. This nesting allows multiple frequency band filters to be stacked vertically without increasing the horizontal footprint, reducing the total electrical signal path length through multiple filters and thereby minimizing cumulative signal loss while maintaining multi-band coverage
Solution Approach 2:
The patent transitions from a planar filter arrangement to a three-dimensional stacked configuration. Filters are arranged in vertical layers with corresponding ports aligned across layers, allowing signals to pass through multiple filters with minimal lateral displacement. This vertical stacking reduces the electrical length of inter-filter connections compared to horizontal arrangements
2Object-affected harmful factors
If filter patterns are extended to improve filtering performance, then electromagnetic noise reduction is improved, but module size increases
Solution Approach 1:
Extension patterns of second and third filters are nested within the boundary defined by the first filter pattern. This nesting confines the electromagnetic noise filtering structures within a compact vertical stack, preventing lateral expansion of the module while maintaining effective noise reduction through extended filter patterns
Solution Approach 2:
The patent uses thin film-like extension patterns that extend vertically from the main filter body. These thin-film structures provide extended electromagnetic noise filtering capability with minimal material volume and small lateral footprint, effectively reducing noise without significantly increasing module size
3Power
If electrical length between antennas and IC is reduced, then gain is improved, but manufacturing precision requirements increase
Solution Approach 1:
The connecting member is segmented into multiple functional layers (first layer with first filter, second layer with second filter, third layer with third filter, and ground layers in between). Each layer is independently manufacturable with standard precision, and the segmented structure allows for modular assembly, reducing cumulative alignment errors compared to a single monolithic structure
Solution Approach 2:
Ground layers are introduced as intermediary elements between the filter layers. These ground layers provide electromagnetic shielding and reference planes that stabilize the electrical characteristics, compensating for minor manufacturing variations and reducing the impact of alignment tolerances on overall performance
Data Source
AI summary
A radio frequency filter module includes: an antenna package including patch antennas and having first and second frequency passbands different from each other; an integrated circuit (IC) package including an IC; and a connecting member disposed between the antenna package and the IC package, and having a laminated structure configured to electrically connect the patch antennas and the IC to each other. The connecting member includes: a first radio frequency filter pattern having the first and second frequency passbands, and including a first port electrically connected to the IC and a second port electrically connected to at least one of the patch antennas; and a second radio frequency filter pattern having the first and second frequency passbands, and including a third port electrically connected to the IC and a fourth port electrically connected to at least another one of the patch antennas.