Laminated High-Frequency Module Layout to Suppress Inductor Coupling
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Solution Overview
Problem
High-frequency modules face challenges in downsizing due to electromagnetic field coupling between inductors, which affects transmission characteristics and harmonic wave attenuation, making it difficult to achieve desired performance.
Innovation Solution
The design includes a laminated body with inductors on individual terminals and an antenna side, arranged such that their magnetic fields do not overlap and are oriented in the same direction, with inner layer electrode patterns on the same layers and strategically placed ground electrodes to prevent magnetic field coupling, ensuring each inductor functions as intended and effectively attenuates harmonic waves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the high-frequency module is downsized, then the module size is reduced, but electromagnetic field coupling occurs between inductors
Solution Approach 1:
The patent utilizes the lamination structure to arrange inductors on different layers (dimensions) of the PCB. By stacking inductors vertically across multiple PCB layers rather than placing them side-by-side on the same plane, the design achieves compact horizontal footprint while maintaining sufficient vertical separation to reduce electromagnetic coupling between adjacent inductors.
Solution Approach 2:
The patent divides the inductor arrangement into segmented groups associated with different terminal types (common terminal side vs. individual terminal side). This segmentation allows for optimized placement strategies where inductors on the common terminal side are positioned away from inductors on the individual terminal side, reducing inter-group coupling while maintaining compact overall size.
2Volume of moving object
If inductors are arranged closely to downsize the module, then the module size is reduced, but transmission characteristics deteriorate due to electromagnetic coupling
Solution Approach 1:
The patent utilizes the lamination structure to arrange inductors on different layers (dimensions) of the PCB. By stacking inductors vertically across multiple PCB layers rather than placing them side-by-side on the same plane, the design achieves compact horizontal footprint while maintaining sufficient vertical separation to reduce electromagnetic coupling between adjacent inductors.
Solution Approach 2:
The patent introduces ground electrodes as intermediary elements positioned between inductors on adjacent PCB layers. These ground electrodes act as electromagnetic shields that intercept and redirect coupling fields, thereby reducing unwanted electromagnetic interaction between inductors while allowing them to be positioned in close proximity for compact design.
3Ease of manufacture
If inductors are placed on the same PCB layers to reduce complexity, then manufacturing is simplified, but electromagnetic field coupling increases
Solution Approach 1:
The patent utilizes the lamination structure to arrange inductors on different layers (dimensions) of the PCB. By stacking inductors vertically across multiple PCB layers rather than placing them side-by-side on the same plane, the design achieves compact horizontal footprint while maintaining sufficient vertical separation to reduce electromagnetic coupling between adjacent inductors.
Solution Approach 2:
The patent divides the inductor arrangement into segmented groups associated with different terminal types (common terminal side vs. individual terminal side). This segmentation allows for optimized placement strategies where inductors on the common terminal side are positioned away from inductors on the individual terminal side, reducing inter-group coupling while maintaining compact overall size.
4Reliability
If inductors are arranged to suppress electromagnetic coupling, then transmission characteristics improve, but device complexity increases
Solution Approach 1:
The patent utilizes the lamination structure to arrange inductors on different layers (dimensions) of the PCB. By stacking inductors vertically across multiple PCB layers rather than placing them side-by-side on the same plane, the design achieves compact horizontal footprint while maintaining sufficient vertical separation to reduce electromagnetic coupling between adjacent inductors.
Solution Approach 2:
The patent employs ground electrodes that serve multiple functions: they provide electromagnetic shielding between inductors, establish reference potential planes for signal integrity, and serve as connection points for circuit functionality. This multi-functionality reduces the need for additional dedicated shielding structures, thereby managing complexity while achieving coupling suppression.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses magnetic field coupling, allowing for desired transmission characteristics and efficient attenuation of second and third harmonic waves, preventing signal leakage and ensuring low-loss signal transmission and reception.
Implementation Method 1
arranged within the laminated body so that directions of generated magnetic fields coincide with one another
Data Source
AI summary
In a high frequency module, an inductor is formed with a common terminal of a switch element as a starting point so as to wind in a substantially spiral shape clockwise when viewed from an upper surface side of a laminated body, and inductors are formed with a first individual external terminal and a second individual external terminal as starting points so as to wind in a substantially spiral shape clockwise when viewed from the upper surface side of the laminated body, the first individual external terminal and the second individual external terminal defining input ends of transmission signals. Other inductors are also formed so as to wind in a substantially spiral shape clockwise when viewed from the upper surface side of the laminated body such that all the directions of magnetic fields generated by the inductors coincide with one another.