Laminated Scintillator Panel for High Luminance X-ray Imaging

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Solution Overview

Problem

Conventional phase contrast imaging techniques in X-ray diagnostics face challenges due to the need for large, thick lattice structures that are difficult to fabricate using silicon wafers, leading to limited area and reduced X-ray shielding effectiveness, especially under high-voltage conditions, and result in attenuated light emission and low luminance.

Innovation Solution

A laminated scintillator panel is developed with alternating scintillator and non-scintillator layers, where the scintillator layers convert X-rays into visible light and the non-scintillator layers transmit this light, allowing for increased thickness and area without the limitations of silicon wafers, with specific compositions and layer configurations optimizing light transmission and emission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a silicon wafer is used to fabricate a lattice structure, then the manufacturing precision and X-ray shielding properties are improved, but the area is restricted and the thickness cannot be increased

Engineering Contradiction:
Improvelattice structure precisionVSAvoidlattice area
Core Design Contradiction:
Manufacturing precisionVSArea of stationary object

Solution Approach 1:

The lattice structure is segmented into multiple thin silicon wafer layers stacked together, allowing each layer to be manufactured with high precision while the stacked configuration achieves large overall area and increased effective thickness

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention uses composite construction by stacking multiple silicon wafer layers with lattice patterns, combining the advantages of high manufacturing precision of individual wafers with the benefits of large area and increased thickness of the stacked assembly

Inventive Principle:
Principle #40Composite materials

2Reliability

If the lattice thickness is increased to improve X-ray shielding, then the X-ray shielding properties are improved, but the manufacturing difficulty increases and even filling metal to the bottom becomes difficult

Engineering Contradiction:
ImproveX-ray shielding effectivenessVSAvoidlattice fabrication ease
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

Instead of manufacturing one thick lattice structure that is difficult to fabricate, the invention segments the thickness into multiple thinner wafer layers that are easier to manufacture and assemble, achieving the same effective shielding thickness through stacking

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The lattice patterns are pre-formed on individual thin silicon wafers where manufacturing is easier, then these pre-fabricated layers are stacked to achieve the desired total thickness and shielding effectiveness

Inventive Principle:
Principle #10Preliminary action

3Illumination intensity

If CsI is used as the phosphor material, then the scintillation properties are improved, but the emission is attenuated due to repeated collision on the silicon lattice wall surface

Engineering Contradiction:
Improvescintillation luminanceVSAvoidlight emission attenuation
Core Design Contradiction:
Illumination intensityVSObject-affected harmful factors

Solution Approach 1:

The invention extracts the light-emitting CsI phosphor material from the constrained silicon lattice structure and places it in an open configuration where light emission is not blocked by silicon walls, eliminating the attenuation problem while preserving scintillation properties

Inventive Principle:
Principle #2Taking out (Extraction)

4Measurement precision

If a conventional phase contrast imaging technique is used, then the sensitivity to soft tissues is improved, but the need for synchrotron X-ray source or minute focus X-ray tube makes it difficult for practical use

Engineering Contradiction:
Improvesoft tissue sensitivityVSAvoidpractical applicability
Core Design Contradiction:
Measurement precisionVSAdaptability or versatility

Solution Approach 1:

The invention creates a simplified version of synchrotron-based phase contrast imaging using conventional X-ray sources combined with the laminated scintillator panel, copying the essential functionality while removing the need for complex synchrotron facilities or minute focus tubes

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The invention changes the key parameter from requiring extreme X-ray source conditions (synchrotron or minute focus) to using conventional X-ray sources, achieving the same soft tissue sensitivity through the specialized laminated scintillator detector design

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The laminated scintillator panel achieves high luminance and large area imaging capabilities, enabling effective phase contrast imaging without the need for expensive or large-scale facilities, and allows for high-pressure X-ray imaging of larger subjects.

Implementation Method 1

a scintillator layer for converting radiation into visible light

Methodology Applied
Scientific EffectScintillation: Scintillation

Data Source

PatentUS10761220B2Laminated scintillator panel
Publication Date: 2020.09.01 KONICA MINOLTA INC
  • US10761220B2 patent drawing
  • US10761220B2 patent drawing

AI summary

A laminated scintillator panel having a structure in which a scintillator layer for converting radiation into visible light and a non-scintillator layer are repeatedly laminated in a direction parallel to an incident direction of radiation, wherein the non-scintillator layer transmits the visible light.Provided is a lattice-shaped laminated scintillator panel with high luminance, a large area, and a thick layer by means completely different from a conventional technique using a silicon wafer.