Laminated Structure with Annular Groove for Wiring Board
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Solution Overview
Problem
The conventional method of manufacturing wiring boards with built-in electronic components results in wasted resources and compromised connection reliability due to the unnecessary formation and mounting of components in unsatisfactory product areas, leading to increased costs and potential electrical connection issues.
Innovation Solution
The method involves forming an opening in satisfactory product areas and an annular groove in unsatisfactory areas, using a dummy electronic component in the latter to maintain thickness uniformity and reduce waste, while omitting unnecessary processes in unsatisfactory areas to minimize resource wastage and ensure reliable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If openings and electronic components are formed in all product areas, then the structure is uniform across the board, but resources are wasted in unsatisfactory areas and connection reliability is compromised
Solution Approach 1:
The patent applies local quality by differentiating the treatment of satisfactory and unsatisfactory product areas. In satisfactory areas, openings with electronic components are formed, while in unsatisfactory areas, annular grooves without electronic components are formed. This localized differentiation allows resource optimization without compromising overall structure uniformity, as both openings and grooves maintain consistent dimensions and are filled with the same insulating layer.
Solution Approach 2:
The patent uses copying by creating annular grooves that replicate the dimensional characteristics of openings without containing electronic components. The grooves are formed with the same width and depth as openings, and both are filled with insulating layer to identical thicknesses, creating a visual and structural copy that maintains uniformity while eliminating waste in unsatisfactory areas.
2Ease of manufacture
If openings and electronic components are formed in all product areas, then the manufacturing process is simplified, but costs increase due to wasted electronic components and adhesive layers
Solution Approach 1:
The patent implements local quality by selectively forming openings only in satisfactory product areas while forming annular grooves in unsatisfactory areas. This approach maintains process simplicity through unified formation steps for both openings and grooves, while reducing manufacturing costs by eliminating electronic components and adhesive layers from unsatisfactory areas.
Solution Approach 2:
The patent applies preliminary action by determining the satisfaction of product area characteristics before forming openings or grooves. This preliminary classification allows the manufacturing process to adapt to each area's quality status, preventing waste of electronic components and adhesive materials in unsatisfactory areas while maintaining consistent processing steps.
3Productivity
If openings are formed in unsatisfactory product areas, then the manufacturing process is consistent across all areas, but connection reliability is compromised
Solution Approach 1:
The patent applies local quality by differentiating between openings in satisfactory areas and annular grooves in unsatisfactory areas. Both structures are formed using the same manufacturing steps and filled with insulating layer to maintain consistent thickness, ensuring manufacturing efficiency. However, only openings in satisfactory areas contain electronic components, preserving connection reliability where quality conditions are met.
Data Source
AI summary
A laminated structure includes an interconnect structure including first and second product areas and a first interconnect layer, and a first insulating layer formed on the interconnect structure. The first product area includes an opening penetrating the first insulating layer, and the second product area includes an annular groove penetrating the first insulating layer. The laminated structure further includes an electronic component mounted inside the opening in the first product area with an annular gap formed between the electronic component and a wall surface defining the opening, an insulating member located inside the groove in the second product area, a second insulating layer that fills the annular gap and the groove, and covers the first insulating layer, the electronic component, and the insulating member, and a second interconnect layer formed on the second insulating layer, and electrically connected to the first interconnect layer.